MCP1754S datasheet(7/42 Pages) MICROCHIP

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DS22276A-page 7

MCP1754/MCP1754S

PWRGD Time Delay

TPG

—

100

—

µs

Rising Edge of VOUT,

RPULLUP = 10 kΩ

Detect Threshold to

PWRGD Active Time

Delay

TVDET_PWRGD

—

200

—

µs

Falling Edge of VOUT after

Transition from

VOUT = VPRWRGD_TH + 50 mV,

to VPWRGD_TH - 50 mV,

RPULLUP = 10kΩ to VIN

AC Performance

Output Delay From VIN To

VOUT = 90% VREG

TDELAY

—240

—

µs

VIN = 0V to 16V, VOUT = 90%

VR,

tr (VIN)= 5V/µs,

COUT = 1 µF, SHDN = VIN

Output Delay From VIN To

VOUT > 0.1V

TDELAY_START

—80

—

µs

VIN = 0V to 16V, VOUT ≥ 0.1V,

tr (VIN)= 5V/µs,

COUT = 1 µF, SHDN = VIN

Output Delay From SHDN

TDELAY_SHDN

—160

—

µs

VIN = 16V, VOUT = 90% VR,

COUT = 1 µF, SHDN = GND to

VIN

Output Noise

—3

—

µV/(Hz)1/2 IL = 50 mA, f = 1 kHz,

COUT = 1 µF

Power Supply Ripple

Rejection Ratio

PSRR

—

VR = 5V, f = 1 kHz, IL =

150 mA,

VINAC = 1V pk-pk, CIN = 0 µF,

VIN = VR + 1.5V

Thermal Shutdown

Temperature

TSD

—150

—

°C

Note 6

Thermal Shutdown

Hysteresis

ΔTSD

—

°C

AC/DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VR + 1V, Note 1, ILOAD = 1 mA, COUT =

1 µF (X7R), CIN = 1 µF (X7R), TA = 25°C, tr(VIN) = 0.5V/µs, SHDN = VIN, PWRGD = 10K to VOUT.

Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note

The minimum VIN must meet two conditions: VIN ≥ 3.6V and VIN ≥ VR + VDROPOUT(MAX).

VR is the nominal regulator output voltage when the input voltage VIN = VRated + VDROPOUT(MAX) or ViIN = 3.6V (which-

ever is greater); IOUT = 1 mA.

TCVOUT = (VOUT-HIGH - VOUT-LOW) *10

6 / (V

R * ΔTemperature), VOUT-HIGH = highest voltage measured over the

temperature range. VOUT-LOW = lowest voltage measured over the temperature range.

Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output

voltage due to heating effects are determined using thermal regulation specification TCVOUT.

Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal VR

measured value. The nominal VR measured value is obtained with

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power

dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained

junction temperatures above 150°C can impact the device reliability.

The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the

desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the

ambient temperature is not significant.

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