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AX8864T Datasheet(PDF) 2 Page - Maxim Integrated Products |
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AX8864T Datasheet(HTML) 2 Page - Maxim Integrated Products |
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2 / 10 page ![]() Low-Dropout, 120mA Linear Regulators 2 ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (VIN = +3.6V, VGND = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. VIN to GND ..................................................................-7V to +7V Output Short-Circuit Duration ............................................Infinite SET to GND ..............................................................-0.3V to +7V SHDN to GND..............................................................-7V to +7V SHDN to IN ...............................................................-7V to +0.3V OUT to GND ................................................-0.3V to (VIN + 0.3V) Continuous Power Dissipation (multilayer board, TA = +70°C) SOT23 (3.9mW/°C above +70°C).............................312.6mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +160°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. PACKAGE THERMAL CHARACTERISTICS (Note 1) SOT23 Junction-to-Ambient Thermal Resistance ( θJA)...............255.9°C/W Junction-to-Case Thermal Resistance ( θJC)......................81°C/W PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Input Voltage (Note 3) VIN 2.5 6.5 V MAX886_T 3.05 3.15 3.25 MAX886_S 2.75 2.84 2.93 Output Voltage VOUT 0mA ≤ IOUT ≤ 50mA, SET = GND MAX886_R 2.70 2.80 2.88 V Adjustable Output Voltage Range (Note 4) VOUT VSET 6.5 V Maximum Output Current 120 mA Current Limit (Note 5) ILIM 280 mA ILOAD = 0mA 68 150 Ground Pin Current IQ SET = GND ILOAD = 50mA 80 µA IOUT = 1mA 1.1 Dropout Voltage (Note 6) IOUT = 50mA 55 120 mV Line Regulation ∆VLNR VIN = 2.5V to 6.5V, SET tied to OUT, IOUT = 1mA -0.15 0 +0.15 %/V SET = GND 0.011 0.040 Load Regulation ∆VLDR IOUT = 0mA to 50mA SET tied to OUT 0.006 %/mA COUT = 1µF 350 Output Voltage Noise 10Hz to 1MHz COUT = 100µF 220 µVRMS SHUTDOWN VIH 2.0 SHDN Input Threshold VIL 0.4 V |
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