TPS63010

TPS63011

TPS63012

SLVS653B – JUNE 2008 – REVISED MAY 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during

storage or handling to prevent electrostatic damage to the MOS gates.

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

OUTPUT

PACKAGE

OUTPUT VOLTAGE

VOLTAGE

PACKAGE

DC/DC at VSEL = 1

DC/DC at

MARKING

VSEL = 0

Adjustable

Adjustable

TPS63010

TPS63010YFF

- 40°C to 85°C

3.3 V

2.8 V

TPS63011

20-Pin WCSP

TPS63011YFF

3.4 V

2.9 V

TPS63012

TPS63012YFF

(1)

Contact the factory to check availability of other fixed output voltage versions.

(2)

The YFF package is available taped and reeled. Add R suffix to device type (e.g., TPS63010YFFR) to order quantities of 3000 devices

per reel. Add T suffix to device type (e.g., TPS63010YFFT) to order quantities of 250 devices per reel.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

TPS6301x

UNITS

Input voltage range on VIN, VINA, VINA1, L1, L2, VOUT, PS, SYNC, VSEL,

– 0.3 to 7

V

EN, FB

Operating junction temperature range

– 40 to 150

°C

Storage temperature range

– 65 to 150

2.5

kV

ESD Voltage

150

V

1

kV

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

ESD testing is performed according to the respective JESD22 JEDEC standard.

DISSIPATION RATINGS TABLE

THERMAL RESISTANCE

POWER RATING

DERATING FACTOR ABOVE

YFF

84 °C/W

1190 mW

12 mW/°C

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX UNIT

Supply voltage at VIN, VINA

2

5.5

V

– 40

85

°C

– 40

125

°C

2

Submit Documentation Feedback

Copyright © 2008–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63010 TPS63011 TPS63012