CS8361

http://onsemi.com

6

Heat Sinks

A heat sink effectively increases the surface area of the

package to improve the flow of heat away from the IC and

into the surrounding air.

Each material in the heat flow path between the IC and the

outside environment will have a thermal resistance. Like

series electrical resistances, these resistances are summed to

RQJA + RQJC ) RQCS ) RQSA

(3)

where:

functions of the package type, heatsink and the interface

between them. These values appear in heat sink data sheets

of heat sink manufacturers.

ORDERING INFORMATION*

Device

Package

CS8361YDPS7G

(Pb−Free)

50 Units/Rail

CS8361YDPSR7G

(Pb−Free)

750 / Tape & Reel

CS8361YDWF16G

SO−16L

(Pb−Free)

46 Units/Rail

CS8361YDWFR16G

SO−16L

(Pb−Free)

1000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Spe-

cifications Brochure, BRD8011/D.

*Contact your local sales representative for other package options including PSOP−20, TO−220−7, DIP−16, and SO−20L.