TDA7718N datasheet(38/40 Pages) STMICROELECTRONICS

38 / 40 page

Package information

TDA7718N

38/40

Doc ID 16502 Rev 1

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 22.

TSSOP28 mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.200

0.047

0.050

0.150

0.002

0.006

0.800

1.000

1.050

0.031

0.039

0.041

0.190

0.300

0.007

0.012

0.090

0.200

0.004

0.008

D 1

9.600

9.700

9.800

0.378

0.382

0.386

6.200

6.400

6.600

0.244

0.252

0.260

E11

4.300

4.400

4.500

0.170

0.173

0.177

0.650

0.026

0.450

0.600

0.750

0.018

0.024

0.030

1.000

0.039

0˚ (min.), 8˚ (max.)

aaa

0.100

0.004

Note: 1. D and E1 does not include mold flash or protrusions.

Mold flash or potrusions shall not exceed 0.15mm

(.006inch) per side.

TSSOP28

0128292 B

Thin Shrink Small Outline Package

JEDEC MO-153-AC

TDA7718N Datasheet(PDF) 38 Page - STMicroelectronics

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