STPS2H100-Y

Characteristics

Doc ID 17944 Rev 1

5/9

Figure 13.

Thermal resistance junction to ambient versus copper surface under each lead (SMB)

Figure 11.

Forward voltage drop versus

forward current (high level)

Figure 12.

Thermal resistance junction to

ambient versus copper surface

under each lead (SMA)

I

(A)

FM

1

10

100

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

T

(Maximum values)

T

(Maximum values)

T

(Maximum values)

T

(Typical values)

T

(Typical values)

V

(V)

FM

0

10

20

30

40

50

60

70

80

90

100

110

120

130

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

S

(cm²)

CU

SMA

Epoxy printed circuit board FR4,

Copper thickness = 35 µm

0

10

20

30

40

50

60

70

80

90

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

S

(cm²)

CU

SMB

Epoxy printed circuit board FR4,

Copper thickness = 35 µm