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STPS3045DJF Datasheet(PDF) 4 Page - STMicroelectronics |
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STPS3045DJF Datasheet(HTML) 4 Page - STMicroelectronics |
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4 / 7 page ![]() Characteristics STPS3045DJF 4/7 Doc ID 16758 Rev 3 Figure 7. Reverse leakage current versus reverse voltage applied (typical values) Figure 8. Junction capacitance versus reverse voltage applied (typical values) 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 0 5 10 15 20 25 30 35 40 45 I (mA) R T = 25 °C j T = 50 °C j T = 75 °C j T = 125 °C j T = 150 °C j T = 100 °C j V (V) R 100 1000 10000 1 10 100 C(pF) V (V) R F = 1 MHz V = 30 mV T = 25 °C osc RMS j Figure 9. Forward voltage drop versus forward current Figure 10. Thermal resistance, junction to ambient, versus copper surface under tab 0 5 10 15 20 25 30 35 40 45 50 55 60 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 T = 125 °C (Maximum values) j T = 25 °C (Maximum values) j V (V) FM T = 125 °C (Typical values) j I (A) FM 0 50 100 150 200 250 01 2 3 45 678 9 10 R (°C/W) th(j-a) Epoxy printed board FR4, copper thickness = 35 µm S (cm²) cu |
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