W78LE51 datasheet(21/21 Pages) WINBOND

21 / 21 page

Preliminary W78LE51

Publication Release Date: December 1998

- 21 -

Revision A1

Package Dimensions, continued

44-pin PQFP

Seating Plane

See Detail F

L 1

Detail F

1. Dimension D & E do not include interlead

flash.

2. Dimension b does not include dambar

protrusion/intrusion.

3. Controlling dimension: Millimeter

4. General appearance spec. should be based

on final visual inspection spec.

0.254

0.101

0.010

0.004

Notes:

Symbol

Min.

Nom.

Max.

Nom.

Min.

Dimension in inch

Dimension in mm

H D

H E

L 1

0.006

0.152

---

0.002

0.075

0.01

0.081

0.014

0.087

0.018

1.90

0.25

0.05

2.05

0.35

2.20

0.45

0.390

0.025

0.063

0.003

0.394

0.031

0.398

0.037

9.9

0.80

0.65

1.6

10.00

0.8

10.1

0.95

0.398

0.394

0.390

0.530

0.520

0.510

13.45

13.2

12.95

10.1

10.00

9.9

0.08

0.031

0.01

0.02

0.25

0.5

---

0.025

0.036

0.635

0.952

0.530

0.520

0.510

13.45

13.2

12.95

0.051

0.075

1.295

1.905

Headquarters

No. 4, Creation Rd. III,

Science-Based Industrial Park,

Hsinchu, Taiwan

TEL: 886-3-5770066

FAX: 886-3-5792766

http://www.winbond.com.tw/

Voice & Fax-on-demand: 886-2-27197006

Taipei Office

11F, No. 115, Sec. 3, Min-Sheng East Rd.,

Taipei, Taiwan

TEL: 886-2-27190505

FAX: 886-2-27197502

Winbond Electronics (H.K.) Ltd.

Rm. 803, World Trade Square, Tower II,

123 Hoi Bun Rd., Kwun Tong,

Kowloon, Hong Kong

TEL: 852-27513100

FAX: 852-27552064

Winbond Electronics North America Corp.

Winbond Memory Lab.

Winbond Microelectronics Corp.

Winbond Systems Lab.

2727 N. First Street, San Jose,

CA 95134, U.S.A.

TEL: 408-9436666

FAX: 408-5441798

Note: All data and specifications are subject to change without notice.

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