HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : MOS200904

Issued Date : 2009.02.27

Revised Date : 2010.07.02

Page No. : 3/4

H8205

HSMC Product Specification

TSOP-6 Dimension

Important Notice:

 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

 HSMC reserves the right to make changes to its products without notice.

 HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

 HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

 Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454

B1

B1

B

A

D

C

F1

K

J

E

F

G

H

F2

K1

1

23

4

5

6

DIM

Min.

Max.

A

2.70

5.10

B

*1.90

-

B1

*0.95

-

C

2.60

3.00

D

1.40

1.80

E

0.30

0.50

F

-

1.10

F1

0

0.10

F2

0.70

1.00

G

*0.25

-

H

*0.45

-

J

*0.12

-

K

*0.60

-

K1

0

o

10

o

*: REF., Unit: mm

Marking:

Pin Style: 1.Source1 2.Drain1&2 3.Source2

4.Gate2 5.Drain1&2 6.Gate1

Note: Green label is used for pb-free packing

Material:

 Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

 Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

6-Lead TSOP-6 Plastic

Surface Mounted Package

HSMC Package Code: ND