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MJD47 Datasheet(PDF) 1 Page - Motorola, Inc |
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MJD47 Datasheet(HTML) 1 Page - Motorola, Inc |
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1 / 6 page ![]() 1 Motorola Bipolar Power Transistor Device Data High Voltage Power Transistors DPAK For Surface Mount Applications Designed for line operated audio output amplifier, switchmode power supply drivers and other switching applications. • Lead Formed for Surface Mount Applications in Plastic Sleeves (No Suffix) • Straight Lead Version in Plastic Sleeves (“–1” Suffix) • Lead Formed Version in 16 mm Tape and Reel (“T4” Suffix) • Electrically Similar to Popular TIP47, and TIP50 • 250 and 400 V (Min) — VCEO(sus) • 1 A Rated Collector Current MAXIMUM RATINGS Rating Symbol MJD47 MJD50 Unit Collector–Emitter Voltage VCEO 250 400 Vdc Collector–Base Voltage VCB 350 500 Vdc Emitter–Base Voltage VEB 5 Vdc Collector Current — Continuous Peak IC 1 2 Adc Base Current IB 0.6 Adc Total Power Dissipation @ TC = 25_C Derate above 25 _C PD 15 0.12 Watts W/ _C Total Power Dissipation* @ TA = 25_C Derate above 25 _C PD 1.56 0.0125 Watts W/ _C Operating and Storage Junction Temperature Range TJ, Tstg – 65 to + 150 _C THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance, Junction to Case R θJC 8.33 _C/W Thermal Resistance, Junction to Ambient* R θJA 80 _C/W Lead Temperature for Soldering Purpose TL 260 _C ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS Collector–Emitter Sustaining Voltage (1) MJD47 (IC = 30 mAdc, IB = 0) MJD50 VCEO(sus) 250 400 — — Vdc Collector Cutoff Current (VCE = 150 Vdc, IB = 0) MJD47 (VCE = 300 Vdc, IB = 0) MJD50 ICEO — — 0.2 0.2 mAdc * When surface mounted on minimum pad sizes recommended. (continued) (1) Pulse Test: Pulse Width v 300 µs, Duty Cycle v 2%. Preferred devices are Motorola recommended choices for future use and best overall value. MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MJD47/D © Motorola, Inc. 1995 NPN SILICON POWER TRANSISTORS 1 AMPERE 250, 400 VOLTS 15 WATTS MJD47 MJD50 *Motorola Preferred Device MINIMUM PAD SIZES RECOMMENDED FOR SURFACE MOUNTED APPLICATIONS inches mm CASE 369A–13 CASE 369–07 * * REV 1 |
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