AOD424 datasheet(2/6 Pages) AOSMD

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AOD424

Symbol

Min

Typ

Max

Units

BVDSS

VDS=20V, VGS=0V

TJ=55°C

IGSS

100

VGS(th)

Gate Threshold Voltage

0.5

1.6

ID(ON)

160

3.6

4.4

TJ=125°C

5.1

6.2

4.5

5.7

Ω

gFS

105

VSD

0.7

Ciss

3080

3860

4630

Coss

520

740

960

Crss

350

580

810

0.6

1.4

2.1

Ω

Qg(4.5V)

Qgs

Qgd

tD(on)

Electrical Characteristics (TJ=25°C unless otherwise noted)

STATIC PARAMETERS

Parameter

Conditions

Drain-Source Breakdown Voltage

ID=250µA, VGS=0V

VGS=10V, VDS=5V

VGS=4.5V, ID=20A

On state drain current

VGS=2.5V, ID=20A

Forward Transconductance

Diode Forward Voltage

VGS=10V, VDS=10V, RL=0.5Ω,

Ω

µA

VDS=VGS ID=250µA

VDS=0V, VGS= ±12V

Zero Gate Voltage Drain Current

Gate-Body leakage current

Ω

VGS=0V, VDS=0V, f=1MHz

Total Gate Charge

RDS(ON)

Static Drain-Source On-Resistance

IDSS

Reverse Transfer Capacitance

VGS=0V, VDS=10V, f=1MHz

Turn-Off DelayTime

VGS=10V, VDS=10V, ID=20A

Gate Source Charge

Gate Drain Charge

Gate resistance

IS=1A,VGS=0V

VDS=5V, ID=20A

SWITCHING PARAMETERS

Maximum Body-Diode Continuous Current

Input Capacitance

Output Capacitance

Turn-On DelayTime

DYNAMIC PARAMETERS

Turn-On Rise Time

tD(off)

trr

Qrr

THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL

COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING

OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,

FUNCTIONS AND RELIABILITY WITHOUT NOTICE.

Body Diode Reverse Recovery Time

RGEN=3Ω

Turn-Off Fall Time

Body Diode Reverse Recovery Charge IF=20A, dI/dt=500A/µs

Turn-Off DelayTime

IF=20A, dI/dt=500A/µs

A. The value of RθJA is measured with the device mounted on 1in

2 FR-4 board with 2oz. Copper, in a still air environment with T

A =25°C. The

Power dissipation P

DSM is based on R

θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends

on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.

B. The power dissipation P

D is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper

dissipation limit for cases where additional heatsinking is used.

C. Repetitive rating, pulse width limited by junction temperature T

J(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep

initial T

J =25°C.

D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.

E. The static characteristics in Figures 1 to 6 are obtained using <300

µs pulses, duty cycle 0.5% max.

F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming

a maximum junction temperature of T

J(MAX)=175°C. The SOA curve provides a single pulse rating.

G. The maximum current rating is package limited.

H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with T

A=25°C.

Rev 0: February 2011

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