ADG601 datasheet(4/8 Pages) AD

4 / 8 page

REV. 0

ADG601/ADG602

–4–

ABSOLUTE MAXIMUM RATINGS

(TA = 25

°C unless otherwise noted)

VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.5 V

VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –6.5 V

Analog Inputs

2 . . . . . . . . . . . . . . . . . V

SS –0.3 V to VDD +0.3 V

Digital Inputs

2 . . . . . . . . . . . . . . . . . . . . –0.3 V to V

DD +0.3 V

or 30 mA, whichever occurs first

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 100 mA

Peak Current, S or D

(Pulsed at 1 ms, 10% Duty Cycle Max) . . . . . . . . . 200 mA

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . .

–40

°C to +85°C

Storage Temperature Range . . . . . . . . . . .

–65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

Micro-SOIC Package

θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 206°C/W

θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44°C/W

SOT_23 Package

θJA Thermal Impedance . . . . . . . . . . . . . . . . . . 229.6°C/W

θJC Thermal Impedance . . . . . . . . . . . . . . . . . . 91.99°C/W

Lead Temperature, Soldering (10 seconds) . . . . . . . . . 300

°C

IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . . . 220

°C

NOTES

1Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

2Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be

limited to the maximum ratings given.

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding Information*

ADG601BRT

–40

°C to +85°C

Plastic Surface-Mount (SOT_23)

RT-6

STB

ADG601BRM

–40

°C to +85°C

Micro Small Outline (Micro-SOIC)

RM-8

STB

ADG602BRT

–40

°C to +85°C

Plastic Surface-Mount (SOT_23)

RT-6

SUB

ADG602BRM

–40

°C to +85°C

Micro Small Outline (Micro-SOIC)

RM-8

SUB

*Branding on SOT_23 and Micro-SOIC packages is limited to three characters due to space constraints.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the ADG601/ADG602 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions

are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

PIN CONFIGURATIONS

6-Lead Plastic Surface Mount (SOT_23)

(RT-6)

TOP VIEW

(Not to Scale)

VDD

VSS

GND

ADG601/

ADG602

8-Lead Small Outline Micro-SOIC

(RM-8)

TOP VIEW

(Not to Scale)

NC = NO CONNECT

VDD

GND

VSS

ADG601/

ADG602

ADG601 Datasheet(PDF) 4 Page - Analog Devices

ADG601 Datasheet(HTML) 4 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8

Datasheet Download

Link URL