ADG719

–4–

REV. A

ORDERING GUIDE

Model

Temperature Range

Brand*

Package Description

Package Option

ADG719BRM

–40

°C to +85°C

S5B

µSOIC (microSmall Outline IC)

RM-8

ADG719BRT

–40

°C to +85°C

S5B

SOT-23 (Plastic Surface Mount)

RT-6

*Brand = Due to package size limitations, these three characters represent the part number.

PIN CONFIGURATIONS

Table I. Truth Table

ADG719 IN

Switch S1

Switch S2

0

ON

OFF

1

OFF

ON

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the ADG719 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

1

Analog, Digital Inputs

2

30 mA, Whichever Occurs First

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA

(Pulsed at 1 ms, 10% Duty Cycle max)

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

µSOIC Package, Power Dissipation . . . . . . . . . . . . . . . 315 mW

θ

. . . . . . . . . . . . . . . . . . . . . 206

°C/W

θ

SOT-23 Package, Power Dissipation . . . . . . . . . . . . . . 282 mW

θ

. . . . . . . . . . . . . . . . . . . . 229.6

°C/W

θ

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational sections

of this specification is not implied. Exposure to absolute maximum rating condi-

tions for extended periods may affect device reliability. Only one absolute maxi-

mum rating may be applied at any one time.

limited to the maximum ratings given.

6-Lead SOT-23

(RT-6)

TOP VIEW

(Not to Scale)

6

5

4

1

2

3

IN

GND

S2

D

S1

ADG719

8-Lead

SOIC

(RM-8)

TOP VIEW

(Not to Scale)

8

7

6

5

1

2

3

4

NC = NO CONNECT

D

S1

GND

S2

NC

IN

NC

ADG719

TERMINOLOGY

Most Positive Power Supply Potential.

GND

Ground (0 V) Reference.

S

Source Terminal. May be an input or output.

D

Drain Terminal. May be an input or output.

IN

Logic Control Input.

Ohmic resistance between D and S.

∆R

ON

On resistance match between any two channels

Flatness is defined as the difference between the

maximum and minimum value of on resistance as

measured over the specified analog signal range.

Source Leakage Current with the switch “OFF.”

Channel Leakage Current with the switch “ON.”

Analog Voltage on Terminals D, S.

“OFF” Switch Source Capacitance.

“OFF” Switch Drain Capacitance.

Delay between applying the digital control input

and the output switching on.

Delay between applying the digital control input

and the output switching off.

“OFF” time or “ON” time measured between the

90% points of both switches, when switching

from one address state to another.

Crosstalk

A measure of unwanted signal that is coupled

through from one channel to another as a result

of parasitic capacitance.

Off Isolation A measure of unwanted signal coupling through

an “OFF” switch.

Bandwidth

The frequency at which the output is attenuated

by –3 dBs.

On Response The frequency reponse of the “ON” switch.

On Loss

The voltage drop across the “ON” switch seen on

the On Response vs. Frequency plot as how many

dBs the signal is away from 0 dB at very low

frequencies.