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ADP3157 Datasheet(PDF) 10 Page - Analog Devices |
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ADP3157 Datasheet(HTML) 10 Page - Analog Devices |
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10 / 12 page ![]() REV. A ADP3157 –10– To correctly implement active voltage positioning, the low fre- quency output impedance (i.e., the output resistance) of the converter should be made equal to the maximum ESR of the output capacitor array. This can be achieved by having a single pole roll-off of the voltage gain of the gm error amplifier, where the pole frequency coincides with the ESR zero of the output capacitor. A gain with single pole roll-off requires that the gm amplifier output pin be terminated by the parallel combination of a resistor and capacitor. The required resistor value can be calculated from the equation: R kRt kRt C TOTAL TOTAL = × 275 275 Ω Ω – where Rt kR I VV TOTAL CS OMAX HI LO = ×× 16 4 . – Ω and where the quantities 16.4 k Ω and 275 kΩ are characteristics of the ADP3157 and the value of the current sense resistor, RCS, has already been determined as above. Although a single termination resistor equal to RC would yield the proper voltage positioning gain, the dc biasing of that resis- tor would determine how the regulation band is centered (i.e., offset). Note that sometimes the specified regulation band is asymmetrical with respect to the nominal VID voltage. With the ADP3157, the offset is already considered as part of the design procedure—no special provision is required. To accomplish the dc biasing, it is simplest to use two resistors to terminate the gm amplifier output, with the lower resistor tied to ground and the upper resistor to the 12 V supply of the IC. The values of these resistors can be calculated using: RR V V UPPER C DIV OS =× and RR V VV LOWER C OS DIV OS =× – where VDIV is the resistor divider supply voltage (e.g., the rec- ommended 12 V), and VOS is the offset voltage required on the amplifier to produce the desired offset at the output. VOS is calculated using Equation 2 below, where VOUT(OS) is the offset from the nominal VID-programmed value to the center of the specified regulation window for the output voltage. (Note this may be either positive or negative.) For clarification, that offset is given by: VV V VID OUT OS HI LO () ()– =+ 1 2 where VHI and VLO are the respective upper and lower limits allowed for regulation. Finally, the compensating capacitance is determined from the equality of the pole frequency of the error amplifier gain and the zero frequency of the impedance of the output capacitor: C C ESR Rt COMP O TOTAL = × Trade-Offs Between DC Load Regulation and AC Load Regulation Casual observation of the circuit operation—e.g., with a voltmeter —would make it appear that the dc load regulation appears to be rather poor compared to a conventional regulator. This would be especially noticeable under very light or very heavy loads where the voltage is “positioned” near one of the extremes of the regulation window rather than near the nominal center value. It must be noted and understood that this low gain char- acteristic (i.e., loose dc load regulation) is inherently required to allow improved transient containment (i.e., to achieve tighter ac load regulation). That is, the dc load regulation is intentionally sacrificed (but kept within specification) in order to minimize the number of capacitors required to contain the load transients produced by the CPU. LAYOUT AND COMPONENT PLACEMENT GUIDELINES The following guidelines are recommended for optimal perfor- mance of a switching regulator in a PC system: General Recommendations 1. For best results, a four-layer (minimum) PCB is recom- mended. This should allow the needed versatility for con- trol circuitry interconnections with optimal placement, a signal ground plane, power planes for both power ground and the input power (e.g., 5 V), and wide interconnection traces in the rest of the power delivery current paths. Each square unit of 1 ounce copper trace has a resistance of ~0.53 mW at room temperature. 2. Whenever high currents must be routed between PCB layers, vias should be used liberally to create several parallel current paths so that the resistance and inductance intro- duced by these current paths is minimized and the via cur- rent rating is not exceeded. 3. The power and ground planes should overlap each other as little as possible. It is generally easiest (although not neces- sary) to have the power and signal ground planes on the same PCB layer. The planes should be connected nearest to the first input capacitor where the input ground current flows from the converter back to the power source (e.g., 5 V). V R Rt VV Rt k V Rt k RI OS C TOTAL OUT OS TOTAL TOTAL CS OMAX =× + + 08 136 17 275 6 . . –. () ΩΩ (2) |
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