REV. A

–6–

OP193/OP293/OP493

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±18 V

Input Voltage

2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±18 V

Differential Input Voltage

±18 V

Output Short-Circuit Duration to Gnd . . . . . . . . . . Indefinite

Storage Temperature Range

P, S Package . . . . . . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Operating Temperature Range

OP193/OP293/OP493E, F . . . . . . . . . . . . –40

°C to +125°C

Junction Temperature Range

P, S Package . . . . . . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature Range (Soldering, 60 sec) . . . . . . . +300

°C

Package Type

θ

JA

3

θ

JC

Units

8-Pin Plastic DIP (P)

103

43

°C/W

8-Pin SOIC (S)

158

43

°C/W

14-Pin Plastic DIP (P)

83

39

°C/W

16-Pin SOL (S)

92

27

°C/W

NOTES

otherwise noted.

±18 V, the input voltage is limited to the supply

voltage.

3

θ

θ

for P-DIP, and

θ

package.

WARNING!

ESD SENSITIVE DEVICE

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the OP193/OP293/OP493 feature proprietary ESD protection circuitry, permanent

damage may occur on devices subjected to high energy electrostatic discharges. Therefore,

proper ESD precautions are recommended to avoid performance degradation or loss of

functionality.

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Description

Option

OP193EP

–40

°C to +125°C

8-Pin Plastic DIP

N-8

OP193ES

–40

°C to +125°C

8-Pin SOIC

SO-8

OP193ES-REEL

–40

°C to +125°C

8-Pin SOIC

SO-8

OP193ES-REEL7

–40

°C to +125°C

8-Pin SOIC

SO-8

OP193FP

–40

°C to +125°C

8-Pin Plastic DIP

N-8

OP193FS

–40

°C to +125°C

8-Pin SOIC

SO-8

OP193FS-REEL

–40

°C to +125°C

8-Pin SOIC

SO-8

OP193FS-REEL7

–40

°C to +125°C

8-Pin SOIC

SO-8

OP193GBC

+25

°C

DICE

OP293EP

–40

°C to +125°C

8-Pin Plastic DIP

N-8

OP293ES

–40

°C to +125°C

8-Pin SOIC

SO-8

OP293ES-REEL

–40

°C to +125°C

8-Pin SOIC

SO-8

OP293ES-REEL7

–40

°C to +125°C

8-Pin SOIC

SO-8

OP293FP

–40

°C to +125°C

8-Pin Plastic DIP

N-8

OP293FS

–40

°C to +125°C

8-Pin SOIC

SO-8

OP293FS-REEL

–40

°C to +125°C

8-Pin SOIC

SO-8

OP293FS-REEL7

–40

°C to +125°C

8-Pin SOIC

SO-8

OP293GBC

+25

°C

DICE

OP493EP

–40

°C to +125°C

14-Pin Plastic DIP

N-14

OP493ES

–40

°C to +125°C

16-Pin SOL

SOL-16

OP493ES-REEL

–40

°C to +125°C

16-Pin SOL

SOL-16

OP493FP

–40

°C to +125°C

14-Pin Plastic DIP

N-14

OP493FS

–40

°C to +125°C

16-Pin SOL

SOL-16

OP493FS-REEL

–40

°C to +125°C

16-Pin SOL

SOL-16

OP493GBC

+25

°C

DICE

DICE CHARACTERISTICS

2

1

34

6

5

8

7

OP493 Die Size 0.106

× 0.143 Inch, 15,158 Sq. Mils Substrate

(Die Backside) Is Connected to V– Transistor Count, 215

2

1

3

4

6

5

7

OP193 Die Size 0.070

× 0.055 Inch, 3,850 Sq. Mils Substrate

(Die Backside) Is Connected to V– Transistor Count, 55

2

1

34

6

5

8

7

OP293 Die Size 0.072

× 0.110 Inch, 7,920 Sq. Mils Substrate

(Die Backside) Is Connected to V– Transistor Count, 105