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SSM2166 Datasheet(PDF) 11 Page - Analog Devices |
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SSM2166 Datasheet(HTML) 11 Page - Analog Devices |
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11 / 15 page ![]() SSM2166 REV. A –11– Figure 23c. Evaluation Board Backside Metallization (Not to Scale) Signal sources are connected to the SSM2166 through a 1/8" phone jack where a 0.1 µF capacitor couples the input signal to the SSM2166’s +IN pin (Pin 7). As shown in Figure 22 and in microphone applications, the phone jack shield can be optionally connected to the board’s ground plane (Jumper J1 inserted into board socket pins labeled “1” and “2”) or to the SSM2166’s VCAR input at Pin 4 (Jumper J1 inserted into board socket pins labeled “1” and “3”). If the signal source is a waveform or function generator, the phone jack shield is to be connected to ground. For ease in making adjustments for all of the SSM2166’s con- figuration parameters, single-turn potentiometers are used throughout. Optional Jumper J2 connects the COMP RATIO pin to ground and sets the SSM2166 for no compression (that is, compression ratio = 1:1). Optional Jumper J3 connects the SSM2166’s POWER DOWN input to ground for normal opera- tion. Jumper J3 can be replaced by an open-drain logic buffer for a digitally-controlled shutdown function. An output signal MUTE function can be implemented on the SSM2166 by con- necting the GAIN ADJUST pin (Pin 2) through a 330 Ω resis- tance to ground. This is provided on the evaluation board via R11 and S1. A capacitor C5, connected between Pin 2 and ground and provided on the evaluation board, can be used to avoid audible “clicks” when using the MUTE function. To configure the SSM2166’s input buffer for gain, provisions for R1, R2, and C2 have been included. To configure the input buffer for unity-gain operation, R1 and R2 are removed, and a direct connection is made between the –IN pin (Pin 6) and the BUFOUT pin (Pin 5) of the SSM2166. The output stage of the SSM2166 is capable of driving > 1 V rms (3 V p-p) into > 5 k Ω loads, and is externally available through an RCA phono jack provided on the board. If the out- put of the SSM2166 is required to drive a lower load resistance Figure 23a. Evaluation Board Topside Silkscreen (Not to Scale) Figure 23b. Evaluation Board Topside Metallization (Not to Scale) |
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