LTC3245

15

3245f

For more information www.linear.com/LTC3245

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However,noresponsibilityisassumedforitsuse.LinearTechnologyCorporationmakesnorepresenta-

tionthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.

package DescripTion

DE/UE Package

12-Lead Plastic DFN (4mm

× 3mm)

(Reference LTC DWG # 05-08-1695 Rev D)

4.00

±0.10

(2 SIDES)

3.00

±0.10

(2 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE A VARIATION OF VERSION

(WGED) IN JEDEC PACKAGE OUTLINE M0-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

0.40

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.70

± 0.10

0.75

±0.05

R = 0.115

TYP

R = 0.05

TYP

2.50 REF

1

6

12

7

PIN 1 NOTCH

R = 0.20 OR

0.35

× 45°

CHAMFER

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

0.00 – 0.05

(UE12/DE12) DFN 0806 REV D

2.50 REF

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

2.20

±0.05

0.70

±0.05

3.60

±0.05

PACKAGE OUTLINE

3.30

±0.10

0.25

± 0.05

0.50 BSC

1.70

± 0.05

3.30

±0.05

0.50 BSC

0.25

± 0.05

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.