USA:

405 S.W. Columbia Street

Bend, Oregon 97702-1035

Phone: (541) 382-8028 FAX: (541)388 -0364

EUROPE:

Chemin de Magret

F-33700 Merignac - France

Phone: (33) 5 57 92 15 15 FAX: (33) 5 56 47 9761

ARF450

30 MHz Linear Test Circuit

81.36 MHz Test Circuit

J1

T1

R1

6.8K

J2

80 V

+

+

-

+

-

R4

10K

L3

C1

1

C3

.47

C2

10n

C4

.1

C5

1n

C6

50p

T2

DUT

R8

20

10W

Bias 0-6V

T1 9:1 RF Transformer on type 43 beads

T2 4:1 RF Transformer. Made from two pieces

of 25 ohm semi-rigid coax with type 43

ferrite bead loading.

J1

T1

J2

150V

+

-

L5

DUT

R1

100

R2

100

L1

L2

L3

L4

T2

C1

C2

C3

C4

C6

C7

C5

TL1

TL2

C1 75-380 pF ARCO 465

C2 25-115 pF ARCO 462

C3 -C5 2 nF NPO 500V chip

C6 10 nF 500V chip

C7 .47 uF Ceramic 500V

L1-L2 50 nH 3t # 14 ga .3" dia

L3-L4 .68 uH 12t #24 enam

L5 2t #20 on bead approx 2 uH

R1-R2 100 ohm 1 W

T1 9:1 RF transformer

T2 1:1 coax balun

TL1-TL2 Printed line 1" long

ARF450

BeO

11405

1

8

;;;;

yyyy

;;

yy

Heat Sink

ARF 450

Compliant

layer

Clamp

ARF450

BeO

11405

.582

.176

.875

dims: inches

1

6

5,8

7

2

1,4

3

8

.125

.125

.210

.210

.060 typ.

.375

.062

.005

.375

HAZARDOUS MATERIAL

WARNING

The ceramic portion of the

device

between

leads

and

mounting surface is beryllium

oxide.

Beryllium oxide dust is

highly toxic when inhaled. Care

must be taken during handling

and mounting to avoid damage

to this area.

These devices

must never be thrown away with

general industrial or domestic

waste.

Typical Mounting

Thermal Considerations and Package Mounting:

The rated 650W power dissipation is only available when the pack-

age mounting surface is at 25˚C and the junction temperature is 200˚C.

The thermal resistance between junctions and case mounting surface

is 0.27 ˚C/W. When installed, an additional thermal impedance of 0.05

˚C/W between the package base and the mounting surface is typical.

Insure that the mounting surface is smooth and flat. Thermal joint com-

pound must be used to reduce the effects of small surface irregulari-

ties. The heatsink should incorporate a copper heat spreader to

obtain best results.

The package is designed to be clamped to a heatsink. A clamp-

ed joint maintains the required mounting pressure while allowing for

thermal expansion of both the device and the heat sink. An L-clamp,

a compliant layer of plastic or rubber, and a 6-32 (M3.5) screw can

provide the minimum 35 lb required mounting force. T = 4 in-lb.