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PCF85063TP Datasheet(PDF) 46 Page - NXP Semiconductors

Part # PCF85063TP
Description  Tiny Real-Time Clock/calendar
PDF  46 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCF85063TP Datasheet(HTML) 46 Page - NXP Semiconductors

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NXP Semiconductors
PCF85063TP
Tiny Real-Time Clock/calendar
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 April 2013
Document identifier: PCF85063TP
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
26. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4.1
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
5
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
7
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
7.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
8
Functional description . . . . . . . . . . . . . . . . . . . 4
8.1
Registers organization . . . . . . . . . . . . . . . . . . . 5
8.2
Control registers . . . . . . . . . . . . . . . . . . . . . . . . 6
8.2.1
Register Control_1 . . . . . . . . . . . . . . . . . . . . . . 6
8.2.1.1
EXT_TEST: external clock test mode . . . . . . . . 6
8.2.1.2
STOP: STOP bit function . . . . . . . . . . . . . . . . . 7
8.2.1.3
Software reset. . . . . . . . . . . . . . . . . . . . . . . . . . 9
8.2.2
Register Control_2 . . . . . . . . . . . . . . . . . . . . . 10
8.2.2.1
MI and HMI: minute and half minute interrupt. 10
8.2.2.2
TF: timer flag . . . . . . . . . . . . . . . . . . . . . . . . . 11
8.2.2.3
COF[2:0]: Clock output frequency . . . . . . . . . 11
8.2.3
Register Offset . . . . . . . . . . . . . . . . . . . . . . . . 11
8.2.3.1
Correction when MODE = 0 . . . . . . . . . . . . . . 13
8.2.3.2
Correction when MODE = 1 . . . . . . . . . . . . . . 14
8.2.3.3
Offset calibration workflow . . . . . . . . . . . . . . . 15
8.2.4
Register RAM_byte . . . . . . . . . . . . . . . . . . . . 16
8.3
Time and date registers . . . . . . . . . . . . . . . . . 16
8.3.1
Register Seconds . . . . . . . . . . . . . . . . . . . . . . 16
8.3.1.1
OS: Oscillator stop . . . . . . . . . . . . . . . . . . . . . 17
8.3.2
Register Minutes. . . . . . . . . . . . . . . . . . . . . . . 18
8.3.3
Register Hours . . . . . . . . . . . . . . . . . . . . . . . . 18
8.3.4
Register Days . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.3.5
Register Weekdays. . . . . . . . . . . . . . . . . . . . . 18
8.3.6
Register Months . . . . . . . . . . . . . . . . . . . . . . . 19
8.3.7
Register Years . . . . . . . . . . . . . . . . . . . . . . . . 20
8.4
Setting and reading the time. . . . . . . . . . . . . . 20
9
Characteristics of the I2C-bus interface . . . . 22
9.1
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
9.2
START and STOP conditions . . . . . . . . . . . . . 22
9.3
System configuration . . . . . . . . . . . . . . . . . . . 22
9.4
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 23
9.5
I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . 24
9.5.1
Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
9.5.2
Clock and calendar READ or WRITE cycles . 24
10
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 26
11
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 26
12
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 27
13
Application information . . . . . . . . . . . . . . . . . 33
14
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 34
15
Handling information . . . . . . . . . . . . . . . . . . . 35
16
Packing information . . . . . . . . . . . . . . . . . . . . 35
16.1
Tape and reel information . . . . . . . . . . . . . . . 35
17
Soldering of SMD packages . . . . . . . . . . . . . . 36
17.1
Introduction to soldering. . . . . . . . . . . . . . . . . 36
17.2
Wave and reflow soldering. . . . . . . . . . . . . . . 36
17.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 36
17.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 37
18
Footprint information . . . . . . . . . . . . . . . . . . . 39
19
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 40
20
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
21
Revision history . . . . . . . . . . . . . . . . . . . . . . . 41
22
Legal information . . . . . . . . . . . . . . . . . . . . . . 42
22.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 42
22.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
22.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 42
22.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 43
23
Contact information . . . . . . . . . . . . . . . . . . . . 43
24
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
25
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
26
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46



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