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TDA2003AV Datasheet(PDF) 14 Page - STMicroelectronics |
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TDA2003AV Datasheet(HTML) 14 Page - STMicroelectronics |
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14 / 19 page ![]() Application information TDA2003A 14/19 Doc ID 018796 Rev 4 3.1.7 Thermal shutdown The presence of a thermal limiting circuit offers the following advantages: 1. An overload on the output (even if it is permanent), or an excessive ambient temperature can be easily withstood. 2. The heatsink can have a smaller factor compared with that of a conventional circuit. There is no damage to the device in the case of excessive junction temperature: only Po (and therefore Ptot) and Id are reduced. 3.2 Practical considerations 3.2.1 Printed circuit board The layout shown in Figure 21 is recommended. If different layouts are used, the ground points of input 1 and input 2 must be well decoupled from the ground of the output through which a rather high current flows. 3.2.2 Assembly recommendations No electrical insulation is required between the package and the heatsink. Pin length should be as short as possible. The soldering temperature must not exceed 260 °C for 12 seconds. Figure 24. Output power and drain current vs. case temperature (RL = 4 Ω) Figure 25. Output power and drain current vs. case temperature (RL = 2 Ω) |
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