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VLMF31 Datasheet(PDF) 5 Page - Vishay Siliconix |
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VLMF31 Datasheet(HTML) 5 Page - Vishay Siliconix |
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5 / 8 page ![]() Document Number 81330 Rev. 1.1, 06-Sep-07 www.vishay.com 5 Vishay Semiconductors VLMF31.. METHOD OF TAPING/POLARITY AND TAPE AND REEL SMD LED (VLM3 - SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertion. The blister tape is a plastic strip with impressed component cavities, covered by a top tape. TAPING OF VLM.3.. REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08 (= 1500 PCS.) REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18 (= 8000 PCS.) PREFERRED SOLDERING PROFILE Figure 9. Tape Dimensions in mm for PLCC-2 Figure 10. Reel Dimensions - GS08 Adhesive Tape Component Cavity Blister Tape 94 8670 1.85 1.65 4.0 3.6 3.6 3.4 2.05 1.95 1.6 1.4 4.1 3.9 4.1 3.9 5.75 5.25 8.3 7.7 3.5 3.1 2.2 2.0 0.25 94 8668 180 178 Identification 4.5 3.5 2.5 1.5 13.00 12.75 63.5 60.5 14.4 max. 10.0 9.0 120° 94 8665 Label: Vishay Type Group Tape Code Production Code Quantity Figure 11. Reel Dimensions - GS18 Figure 12. Vishay Lead (Pb)-free Reflow Soldering Profile (acc. to J-STD-020C) Figure 13. Double Wave Soldering of Opto Devices (all Packages) 321 329 Identification 4.5 3.5 2.5 1.5 13.00 12.75 62.5 60.0 14.4 max. 10.4 8.4 120° 18857 Label: Vishay Type Group Tape Code Production Code Quantity 0 50 100 150 200 250 300 0 50 100 150 200 250 300 Time (s) 240 °C 245 °C max. 260 °C max. 120 s max. 100 s 217 °C max. 30 s max. ramp up 3 °C/s max. ramp down 6 °C/s 19885 IR Reflow Soldering Profile for lead (Pb)-free soldering Preconditioning acc. to JEDEC Level 2a max. 2 cycles allowed 255 °C 235 °C...260 °C 2 K/s ca. 200 K/s ca. 2 K/s second wave first wave ca. 5 K/s 5 s full line: typical dotted line: process limits Time (s) Lead Temperature 300 250 200 150 100 50 0 0 100 150 200 250 948626-1 TTW Soldering (acc. to CECC00802) 50 100 °C...130 °C forced cooling |
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