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S885 Datasheet(PDF) 22 Page - EPCOS |
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S885 Datasheet(HTML) 22 Page - EPCOS |
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22 / 27 page  8 Placement and orientation of SMD NTC thermistors on PCB a) Component placement It is recommended that the PC board should be held by means of some adequate supporting pins such as shown left to prevent the SMDs from being damaged or cracked. b) Cracks When placing a component near an area which is apt to bend or a grid groove on the PC board, it is advisable to have both electrodes subjected to uniform stress, or to position the component's electrodes at right angles to the grid groove or bending line (see c) Component orientation). c) Component orientation Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. Temperature measurement and compensation B57885S Leaded NTC thermistors, lead spacing 5 mm S885 Page 22 of 27 Please read Cautions and warnings and Important notes at the end of this document. |
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