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MCP1603B Datasheet(PDF) 5 Page - Microchip Technology

Part # MCP1603B
Description  2.0 MHz, 500 mA Synchronous Buck Regulator
PDF  34 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP1603B Datasheet(HTML) 5 Page - Microchip Technology

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 2007-2012 Microchip Technology Inc.
DS22042B-page 5
MCP1603/B/L
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VIN - GND.......................................................................+6.0V
All Other I/O ............................... (GND - 0.3V) to (VIN + 0.3V)
LX to GND .............................................. -0.3V to (VIN + 0.3V)
Output Short Circuit Current ................................. Continuous
Power Dissipation (Note 5) .......................... Internally Limited
Storage Temperature ....................................-65°C to +150°C
Ambient Temp. with Power Applied ................-40°C to +85°C
Operating Junction Temperature...................-40°C to +125°C
ESD Protection On All Pins:
HBM ............................................................................. 4 kV
MM ..............................................................................300V
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational sections of this specifica-
tion is not intended. Exposure to maximum rating con-
ditions for extended periods may affect device
reliability.
DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF,
L = 4.7 µH, VOUT(ADJ) = 1.8V, IOUT =100 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C
to +85°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input Characteristics
Input Voltage
VIN
2.7
—
5.5
V
Note 1
Maximum Output Current
IOUT
500
——
mA
Note 1
Shutdown Current
IIN_SHDN
—
0.1
1
µA
SHDN = GND
Quiescent Current - PFM
IQ
—45
60
µA
SHDN = VIN, IOUT = 0 mA,
device switching
Quiescent Current - PWM
IQ
1.0
2.7
4
mA
SHDN = VIN, IOUT = 0 mA,
device switching (MCP1603B)
Shutdown/UVLO/Thermal Shutdown Characteristics
SHDN, Logic Input Voltage Low
VIL
——
15
%VIN VIN = 2.7V to 5.5V
SHDN, Logic Input Voltage High
VIH
45
——
%VIN VIN = 2.7V to 5.5V
SHDN, Input Leakage Current
IL_SHDN
-1.0
±0.1
1.0
µA
VIN = 2.7V to 5.5V
Undervoltage Lockout
UVLO
2.12
2.28
2.43
VVIN Falling
Undervoltage Lockout Hysteresis
UVLOHYS
—140
—
mV
Thermal Shutdown
TSHD
—150
—
°C
Note 4, Note 5
Thermal Shutdown Hysteresis
TSHD-HYS
—10
—
°C
Note 4, Note 5
Note 1:
The input voltage should be greater then the output voltage plus headroom voltage; higher load currents
increase the input voltage required for regulation. MCP1603B device requires a minimum load for
regulation. See Section 2.0, Typical Performance Curves for typical operating voltage ranges.
2:
Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.
3:
VR is the output voltage setting.
4:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
temperature and the thermal resistance from junction to air (i.e. TA, TJ, JA). Exceeding the maximum
allowable power dissipation causes the device to initiate thermal shutdown.
5:
The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin
to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits
must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.
6:
The current limit threshold is a cycle-by-cycle peak current limit.



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