PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

Op Temp (°C)

Top-Side Markings

(4)

Samples

LM555CM

ACTIVE

SOIC

D

8

95

TBD

Call TI

Call TI

0 to 70

LM

555CM

LM555CM/NOPB

ACTIVE

SOIC

D

8

95

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

0 to 70

LM

555CM

LM555CMM

ACTIVE

VSSOP

DGK

8

1000

TBD

Call TI

Call TI

0 to 70

Z55

LM555CMM/NOPB

ACTIVE

VSSOP

DGK

8

1000

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

0 to 70

Z55

LM555CMMX/NOPB

ACTIVE

VSSOP

DGK

8

3500

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

0 to 70

Z55

LM555CMX

ACTIVE

SOIC

D

8

2500

TBD

Call TI

Call TI

0 to 70

LM

555CM

LM555CMX/NOPB

ACTIVE

SOIC

D

8

2500

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

0 to 70

LM

555CM

LM555CN

ACTIVE

PDIP

P

8

40

TBD

Call TI

Call TI

0 to 70

LM

555CN

LM555CN/NOPB

ACTIVE

PDIP

P

8

40

Green (RoHS

& no Sb/Br)

SN

Level-1-NA-UNLIM

0 to 70

LM

555CN

MC1455P1

ACTIVE

PDIP

P

8

40

TBD

Call TI

Call TI

0 to 70

LM

555CN

NE555V

ACTIVE

PDIP

P

8

40

TBD

Call TI

Call TI

0 to 70

LM

555CN

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.