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MPC8270VR Datasheet(PDF) 76 Page - Freescale Semiconductor, Inc |
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MPC8270VR Datasheet(HTML) 76 Page - Freescale Semiconductor, Inc |
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76 / 83 page  MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 2 76 Freescale Semiconductor Package Description 9.1 Package Parameters This table provides package parameters. NOTE: Temperature Reflow for the VR Package In the VR package, sphere composition is lead-free (see Table 2). This requires higher temperature reflow than what is required for other PowerQUICC II packages. Consult “Freescale PowerQUICC II Pb-Free Packaging Information” (MPC8250PBFREEPKG) available on www.freescale.com. Table 26. Package Parameters Package SoCs Outline (mm) Type Interconnects Pitch (mm) Nominal Unmounted Height (mm) ZU MPC8280 MPC8270 37.5 × 37.5 TBGA 480 1.27 1.55 VV MPC8280 MPC8270 37.5 × 37.5 TBGA 480 1.27 1.55 VR MPC8275VR MPC8270VR 27 × 27 PBGA 516 1 2.25 ZQ MPC8275ZQ MPC8270ZQ 27 × 27 PBGA 516 1 2.25 |
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