15.0

(.591)

8.1

(.319)

11.7

(.461)

DE

AC

B

2.0 +0.03/-0.05

(.079 +.001/-.002)

DIA.

1.5 +0.03/-0.05

(.059 +.001/-.002)

DIA.

1.2

(.047)

(ENCODER)

(SWITCH

OR

DUMMY

TERMINALS)

5 PLCS.

1.0

(.039)

3.0

(.118)

14.2

(.559)

18.0

(.709)

≤ 10

≤ (.394)

TOLERANCES (UNLESS OTHERWISE NOTED):

(BOTTOM VIEW)

(SIDE VIEW)

(TOP VIEW)

Common Dimensions

=

±0.3

±(.012)

> 10

>(.394)

=

±0.5

±(.020)

5.0

(.197)

1.0

(.039)

5.0

(1.97)

4.5

(.177)

(TOP VIEW)

15.0

(.591)

8.1

(.319)

11.7

(.461)

DE

AC

B

3.0

(.118)

14.2

(.559)

18.0

(.709)

Specifications are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their specific applications.

PEC11S Series - 12 mm SMD Incremental Encoder

Product Dimensions

DIMENSIONS:

MM

(INCHES)

Solder Profile

Applications

Level control, tuning and timer settings in:

60 Seconds Max.

300

200

80~100 Seconds

Processing Method: Reflow soldering with infrared heat or forced air convection (only once).

Time

150 ± 5 °C

260 °C Max.

(3 Seconds Max.)

100

Recommended PCB Layout

2.05 +0.1/-0

(.081 +.004/-0)

DIA.

HOLES

2.2 x 1.55 +0.1/-0

(.087 x .061 +.004/-0)

DIA.

HOLES

1.3 ± 0.1

(.051 ± .004)

5 PLCS.

2 PLCS.

8.2 ± 0.1

(.323 ± .004)

8.5 ± 0.1

(.335 ± .004)

12.6 + 0.1

(.496 ± .004)

19.0 + 0.1

(.748 ± .004)

2.4 ± .01

(.094 ± .004)

4.5 ± 0.1

(.177 ± .004)

4.0 ± 0.1

(.157 ± .004)

6.3 ± 0.1

(.248 ± .004)

7.5 ± 0.1

(.295 ± .004)

12.5 ± 0.1

(.492 ± .004)

5.0 ± 0.1

(.197 ± .004)

9.0 ± 0.1

(.354 ± .004)

16.5 ± 0.1

(.650 ± .004)

Notes:

1. No clean solder paste is recommended.

2. Aqueous wash is not recommended.

3. Use of water soluble soldering flux shall

be avoided due to possible corrosion.

4. Multiple passes through the soldering

process is not recommended.