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LM2674 Datasheet(PDF) 5 Page - Texas Instruments

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Part # LM2674
Description  Efficiency up to 96%, Available in SOIC-8, 8-Pin PDIP and WSON
PDF  32 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

LM2674 Datasheet(HTML) 5 Page - Texas Instruments

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LM2674
www.ti.com
SNVS007F – SEPTEMBER 1998 – REVISED APRIL 2013
All Output Voltage Versions
Specifications with standard type face are for TJ = 25°C, and those with bold type face apply over full Operating
Temperature Range. Unless otherwise specified, VIN = 12V for the 3.3V, 5V, and Adjustable versions and VIN = 24V for the
12V version, and ILOAD = 100 mA.
Symbol
Parameters
Conditions
Typ
Min
Max
Units
DEVICE PARAMETERS
IQ
Quiescent Current
VFEEDBACK = 8V
2.5
3.6
mA
For 3.3V, 5.0V, and ADJ Versions
VFEEDBACK = 15V
2.5
mA
For 12V Versions
ISTBY
Standby Quiescent Current
ON/OFF Pin = 0V
50
100/150
μA
ICL
Current Limit
0.8
0.62/0.575
1.2/1.25
A
IL
Output Leakage Current
VIN = 40V, ON/OFF Pin = 0V
1
25
μA
VSWITCH = 0V
VSWITCH = −1V, ON/OFF Pin = 0V
6
15
mA
RDS(ON)
Switch On-Resistance
ISWITCH = 500 mA
0.25
0.40/0.60
Ω
fO
Oscillator Frequency
Measured at Switch Pin
260
225
275
kHz
D
Maximum Duty Cycle
95
%
Minimum Duty Cycle
0
%
IBIAS
Feedback Bias
VFEEDBACK = 1.3V
85
nA
Current
ADJ Version Only
VS/D
ON/OFF Pin
Turn-On Threshold, Rising(1)
1.4
0.8
2.0
V
Voltage Theshold
IS/D
ON/OFF Pin Current
ON/OFF Pin = 0V
20
7
37
μA
θJA
Thermal Resistance
P Package, Junction to Ambient(2)
95
°C/W
D Package, Junction to Ambient(2)
105
(1)
The ON/OFF pin is internally pulled up to 7V and can be left floating for always-on operation.
(2)
Junction to ambient thermal resistance with approximately 1 square inch of printed circuit board copper surrounding the leads. Additional
copper area will lower thermal resistance further. See Application Information section in the application note accompanying this
datasheet and the thermal model in LM267X Made Simple (version 6.0) software. The value
θJ−A for the WSON (NHN) package is
specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance
and power dissipation for the WSON package, refer to Application Note AN-1187.
Copyright © 1998–2013, Texas Instruments Incorporated
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