TPS2206

DUALSLOT PC CARD POWERINTERFACE SWITCH

WITH RESET FOR SERIAL PCMCIA CONTROLLER

SLVS138D − MAY 1996 − REVISED JANUARY 2001

4

POST OFFICE BOX 655303

Terminal Functions

TERMINAL

NAME

NO.

I/O

DESCRIPTION

NAME

DB, DF

DAP

I/O

DESCRIPTION

3.3V

15, 16, 17

16, 17, 18

I

3.3-V VCC input for card power

5V

1, 2, 30

1, 2, 32

I

5-V VCC input for card power and/or chip power

12V

7, 24

8, 25

I

12-V Vpp input for card power

AVCC

9, 10, 11

10, 11, 12

O

Switched output that delivers 0 V, 3.3 V, 5 V, or high impedance to card

AVPP

8

9

O

Switched output that delivers 0 V, 3.3 V, 5 V, 12 V, or high impedance to card

BVCC

20, 21, 22

21, 22, 23

O

Switched output that delivers 0 V, 3.3 V, 5 V, or high impedance

BVPP

23

24

O

Switched output that delivers 0 V, 3.3 V, 5 V, 12 V, or high impedance

CLOCK

4

5

I

Logic-level clock for serial data word

DATA

3

4

I

Logic-level serial data word

GND

12

13

Ground

LATCH

5

6

I

Logic-level latch for serial data word

NC

13, 19, 25,

26, 27,

28, 29

3, 19, 26,

27, 28, 29,

30, 31

No internal connection

OC

18

20

O

Logic-level overcurrent. OC reports output that goes low when an overcurrent condition exists

RESET

6

7

I

Logic-level RESET input active high. Do not connect if terminal 14 is used.

RESET

14

14

I

Logic-level RESET input active low. Do not connect if terminal 6 is used.

−0.3 V to 7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−0.3 V to 7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−0.3 V to 14 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Logic input voltage

−0.3 V to 7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous total power dissipation

See Dissipation Rating Table

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

internally limited

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

internally limited

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−40

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−55

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DISSIPATION RATING TABLE

PACKAGE

TA ≤ 25°C

POWER RATING

DERATING FACTOR‡

ABOVE TA = 25°C

TA = 70°C

POWER RATING

TA = 85°C

POWER RATING

DB

1024 mW

8.2 mW/

°C

655 mW

532 mW

DF

1158 mW

9.26 mW/

°C

741 mW

602 mW

DAP

No backplane

1625 mW

13 mW/

°C

1040 mW

845 mW

DAP

Backplane§

6044 mW

48.36 mW/

°C

3869 mW

3143 mW

‡ These devices are mounted on an FR4 board with no special thermal considerations.

§ 2-oz backplane with 2-oz traces; 5.2-mm × 11-mm thermal pad with 6-mil solder; 0.18-mm diameter vias in a 3×6 array.