PACKAGE OPTION ADDENDUM

www.ti.com

21-Mar-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

Op Temp (°C)

Top-Side Markings

(4)

Samples

TPS2206IDAP

ACTIVE

HTSSOP

DAP

32

46

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-3-260C-168 HR

TPS2206I

TPS2206IDAPG4

ACTIVE

HTSSOP

DAP

32

46

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-3-260C-168 HR

TPS2206I

TPS2206IDAPR

ACTIVE

HTSSOP

DAP

32

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-3-260C-168 HR

-40 to 85

TPS2206I

TPS2206IDAPRG4

ACTIVE

HTSSOP

DAP

32

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-3-260C-168 HR

-40 to 85

TPS2206I

TPS2206IDB

ACTIVE

SSOP

DB

30

50

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TPS2206I

TPS2206IDBG4

ACTIVE

SSOP

DB

30

50

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TPS2206I

TPS2206IDBLE

OBSOLETE

SSOP

DB

30

TBD

Call TI

Call TI

-40 to 85

TPS2206IDBR

ACTIVE

SSOP

DB

30

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TPS2206I

TPS2206IDBRG4

ACTIVE

SSOP

DB

30

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TPS2206I

TPS2206IDF

OBSOLETE

SSOP

DF

30

TBD

Call TI

Call TI

TPS2206IDFLE

OBSOLETE

SSOP

DF

30

TBD

Call TI

Call TI

-40 to 85

TPS2206IDFR

LIFEBUY

SSOP

DF

30

TBD

Call TI

Call TI

-40 to 85

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.