AYF530865 datasheet(6/6 Pages) PANASONIC

6 / 6 page

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

ACCTB13E 201204-T

Notes on Using FPC Connectors (Common)

PC board design

Design the recommended foot pattern in

order to secure the mechanical strength

in the soldered areas of the terminal.

FPC and equipment design

Design the FPC based with

recommended dimensions to ensure the

required connector performance.

When back lock type is used, secure

enough space for closing the lever and

for open-close operation of the lever.

Due to the FPC size, weight, or the

reaction force of the routed FPC.

Carefully check the equipment design

and take required measures to prevent

the FPC from being removed due to a fall,

vibration, or other impact.

Connector mounting

Excessive mounter chucking force may

deform the molded or metal part of the

connector. Consult us in advance if

chucking is to be applied.

Soldering

1) Manual soldering.

• Due to the connector’s compact size, if

an excessive amount of solder is applied

during manual soldering, the solder may

creep up near the contact points, or

solder interference may cause imperfect

contact.

• Make sure that the soldering iron tip is

heated within the temperature and time

limits indicated in the speciﬁcations.

• Flux from the solder wire may adhere to

the contact surfaces during soldering

operations. After soldering, carefully

check the contact surfaces and clean off

any ﬂux before use.

• Be aware that a load applied to the

connector terminals while soldering may

displace the contact.

• Thoroughly clean the iron tip.

2) Reﬂow soldering

• Screen-printing is recommended for

printing paste solder.

• To achieve the appropriate soldering

state, make sure that the reﬂow

temperature, PC board foot pattern,

window size and thickness of metal mask

are recommended condition.

• Note that excess solder on the terminals

prevents complete insertion of the FPC,

and that excess solder on the soldering

terminals prevents the lever from rotating.

• Consult us when using a screen-printing

thickness other than that recommended.

• Depending on the size of the connector

being used, self alignment may not be

possible. Accordingly, carefully position

the terminal with the PC board pattern.

• The recommended reﬂow temperature

proﬁle is given in the ﬁgure below

Recommended reﬂow temperature

proﬁle

• The temperature is measured on the

surface of the PC board near the

connector terminal.

• Certain solder and ﬂux types may cause

serious solder creeping. Solder and ﬂux

characteristics should be taken into

consideration when setting the reﬂow

soldering conditions.

• When performing reﬂow soldering on

the back of the PC board after reﬂow

soldering the connector, secure the

connector using, for example, an

adhesive. (Double reﬂow soldering on the

same side is possible)

3) Reworking on a soldered portion

• Finish reworking in one operation.

• For reworking of the solder bridge, use

a soldering iron with a ﬂat tip. Do not add

ﬂux, otherwise the ﬂux may creep to the

contact parts.

• Use a soldering iron whose tip

temperature is within the temperature

range speciﬁed in the speciﬁcations.

Do not drop or handle the

connector carelessly. Otherwise, the

terminals may become deformed due

to excessive force or applied

solderability may be during reﬂow

degrade.

Don’t open/close the lever or insert/

remove an FPC until the connector is

soldered. Forcibly applied external

pressure on the terminals can weaken

the adherence of the terminals to the

molded part or cause the terminals to

lose their evenness. In addition, do

not insert an FPC into the connector

before soldering the connector.

When cutting or bending the PC

board after mounting the connector,

be careful that the soldered sections

are subjected to excessive force.

Other Notes

When coating the PC board after

soldering the connector (to prevent the

deterioration of insulation), perform the

coating in such a way so that the coating

does not get on the connector.

The connectors are not meant to be used

for switching.

Terminal

Paste solder

PC board foot pattern

150

°C

180

°C

230

°C

220

°C

200

°C

260

°C

Temperature

Upper limit (Soldering heat resistance)

Lower limit (Solder wettability)

Preheating

Peak temperature

Time

25 sec.

70 sec.

60 to 120 sec.

Please refer to the latest product

speciﬁcations when designing your

product.

The soldered areas should not be subjected to force.

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