5

Absolute Maximum Ratings

(No Derating Required up to 70°C)

Storage Temperature .............................................................................................-55°C to +125°C

Operating Temperature ..........................................................................................-40°C to +85°C

Lead Solder Temperature .............................. 260°C for 10 s (1.6 mm below seating plane)

Supply Voltage – V

CC

..........................................................................................................0 V to 20 V

Average Input Current - I

I

...................................................................................-30 mA to 30 mA

Peak Transient Input Current - I

I

Enable Input Voltage – V

E

...........................................................................................-0.5 V to 20 V

Output Voltage – V

O

.......................................................................................................-0.5 V to 20 V

Average Output Current – I

O

...................................................................................................25 mA

Input Power Dissipation – P

I

Output Power Dissipation – P

O

Infrared and Vapor Phase Reflow Temperature

(Option #300) ..................................................................................... see Fig. 1, Thermal Profile

Recommended Operating Conditions

Parameter

Symbol

Min.

Max.

Units

Power Supply Voltage

V

CC

4.5

20

Volts

Forward Input Current

I

SI

0

2.0

mA

(SPACE)

Forward Input Current

I

MI

14

24

mA

(MARK)

Operating Temperature

T

A

0

70

°C

Fan Out

N

0

4

TTL Loads

Logic Low Enable

V

EL

0

0.8

Volts

Voltage

Logic High Enable

V

EH

2.0

20

Volts

Voltage

Insulation and Safety Related Specifications

Parameter

Symbol

Value

Units

Conditions

Min. External Air Gap

L(IO1)

7.1

mm

Measured from input terminals to output

(External Clearance)

terminals, shortest distance through air

Min. External Tracking Path

L(IO2)

7.4

mm

Measured from input terminals to output

(External Creepage)

terminals, shortest distance path along body

Min. Internal Plastic Gap

0.08

mm

Through insulation distance, conductor to

(Internal Clearance)

conductor, usually the direct distance

between the photoemitter and photodetector

inside the optocoupler cavity

Tracking Resistance

CTI

200

volts

DIN IEC 112/VDE 0303 PART 1

(Comparative Tracking Index)

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

Option 300 – surface mount classification is Class A in accordance with CECC 00802.