AT24C128CSSUMB datasheet(17/22 Pages) ATMEL

17 / 22 page

Atmel AT24C128C [DATASHEET]

8734B–SEEPR–9/2012

13.2 8X — 8-lead TSSOP

DRAWING NO.

REV.

TITLE

GPC

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

1.20

0.05

0.15

0.80

1.00

1.05

2.90

3.00

3.10

2, 5

6.40 BSC

4.30

4.40

4.50

3, 5

0.19

–

0.30

0.65 BSC

0.45

0.60

0.75

1.00 REF

0.09

0.20

Side View

End View

Top View

Pin 1 indicator

this corner

Notes:

1. This drawing is for general information only.

Refer to JEDEC Drawing MO-153, Variation AA, for proper

dimensions, tolerances, datums, etc.

2. Dimension D does not include mold Flash, protrusions or gate

burrs. Mold Flash, protrusions and gate burrs shall not exceed

0.15mm (0.006in) per side.

3. Dimension E1 does not include inter-lead Flash or protrusions.

Inter-lead Flash and protrusions shall not exceed 0.25mm

(0.010in) per side.

4. Dimension b does not include Dambar protrusion.

Allowable Dambar protrusion shall be 0.08mm total in excess

of the b dimension at maximum material condition. Dambar

cannot be located on the lower radius of the foot. Minimum

space between protrusion and adjacent lead is 0.07mm.

5. Dimension D and E1 to be determined at Datum Plane H.

Package Drawing Contact:

packagedrawings@atmel.com

6/22/11

8X, 8-lead 4.4mm Body, Plastic Thin

Shrink Small Outline Package (TSSOP)

TNR

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