ADN8830

–22–

REV. D

OUTLINE DIMENSIONS

Figure 26. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very Very Thin Quad

(CP-32-7)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADN8830ACPZ

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-32-7

ADN8830ACPZ-REEL

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-32-7

ADN8830ACPZ-REEL7

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-32-7

REVISION HISTORY

3/12—Rev. C to Rev. D

Added EPAD Notation .....................................................................3

Updated Outline Dimensions........................................................22

Changes to Ordering Guide...........................................................22

11/03—Rev. B to Rev. C

Changes to Ordering Guide.............................................................3

Deleted Figure 24 ............................................................................21

Deleted Boosting the Output Voltage section .............................22

Deleted Figure 26 ............................................................................22

Deleted Equations 45, 46 and 47 ...................................................22

Updated Outline Dimensions........................................................23

8/03—Rev. A to Rev. B

Updated Ordering Guide .................................................................3

Updated Thermal Setup Section .....................................................8

Updated Outline Dimensions........................................................23

2/03—Rev. 0 to Rev. A

Renumbered Figures.......................................................... Universal

Changes to Thermistor Setup Section............................................8

Changes to Figure 14 ......................................................................15

Changes to Figure 23 ......................................................................20

Changes to Figure 25 ......................................................................21

Updated Outline Dimensions........................................................23

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

32

9

16

17

24

25

8

EXPOSED

PAD

PIN 1

INDICATOR

3.25

3.10 SQ

2.95

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

©2012 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D02793-0-3/12(B)