| Electronic Components Datasheet Search |
|
LTC4555 Datasheet(PDF) 4 Page - Linear Technology |
|
|
|||||||||||||||||||||||||||||
LTC4555 Datasheet(HTML) 4 Page - Linear Technology |
|
4 / 8 page ![]() LTC4555 4 4555fb TYPICAL PERFORMANCE CHARACTERISTICS VCC Short-Circuit Current IBAT vs VBAT PIN FUNCTIONS TEMPERATURE (°C) –40 170 150 130 110 90 70 50 20 60 4555 G01 –20 0 40 80 100 TA = –40°C VBAT (V) 2.5 22 20 18 16 14 12 10 4.0 5.0 4555 G02 3.0 3.5 4.5 5.5 6.0 VCC = 1.8V VCC = 3V TA = 25°C TA = 85°C TA = 85°C TA = 25°C TA = –40°C SHDN (Pin 1): Controller Driven Shutdown Pin. This pin should be high (DVCC) for normal operation and low to activate a low current shutdown mode. VSEL (Pin 2): VCC Voltage Select Pin. A low level selects VCC = 1.8V while driving this pin to DVCC selects VCC = 3V. DVCC (Pin 3): Supply Voltage for the Controller Side I/O Pins (CIN, RIN, DATA). When below 1.1V, the VCC supply is disabled. This pin should be bypassed with a 0.1μF ceramic capacitor close to the pin. NC (Pins 4, 6, 12, 16): No Connect. VBAT (Pin 5): VCC Supply Input. This pin can be between 3V and 6V for normal operation. VBAT quiescent current reduces to <1μA in shutdown. This pin should be bypassed with a 0.1μF ceramic capacitor close to the pin. VCC (Pin 7): SIM Card VCC Supply. A 1μF low ESR capacitor needs to be connected close to the VCC pin for stable opera- tion. This pin is discharged to GND during shutdown. I/O (Pin 8): SIM-Side Data I/O. The SIM card output must be on an open-drain driver capable of sourcing >1mA. RST (Pin 9): Reset Output Pin for the SIM Card. GND (Pin 10): Ground for the SIM and Controller. Proper grounding and bypassing is required to meet 14kV ESD specifications. CLK (Pin 11): Clock Output Pin for the SIM Card. This pin is pulled to ground during shutdown. Fast rising and falling edges necessitate careful board layout for the CLK node. CIN (Pin 13): Clock Input from the Controller. RIN (Pin 14): Reset Input from the Controller. DATA (Pin 15): Controller Side Data I/O. This pin is used for bidirectional data transfer. The controller output must be an open-drain configuration. The open-drain output must be capable of sinking greater than 1mA. Exposed Pad (Pin 17): GND. Must be soldered to PCB. |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |