ADG1636

Rev. A | Page 16 of 16

OUTLINE DIMENSIONS

16

9

8

1

PIN 1

SEATING

PLANE

8°

0°

4.50

4.40

4.30

6.40

BSC

5.10

5.00

4.90

0.65

BSC

0.15

0.05

1.20

MAX

0.20

0.09

0.75

0.60

0.45

0.30

0.19

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 33. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-220-VGGC.

1

0.65

BSC

0.60 MAX

PIN 1

INDICATOR

1.95 BCS

0.50

0.40

0.30

0.25 MIN

3.75

BSC SQ

TOP VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

COPLANARITY

0.08

1.00

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

4.00

BSC SQ

2.65

2.50 SQ

2.35

16

5

13

8

9

12

4

EXPOSED

PAD

BOTTOM VIEW

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 34. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad (CP-16-13)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADG1636BRUZ1

−40°C to +125°C

16- Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG1636BRUZ-REEL1

−40°C to +125°C

16- Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG1636BRUZ-REEL71

−40°C to +125°C

16- Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG1636BCPZ- REEL1

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-13

ADG1636BCPZ-REEL71

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-13

©2009 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D07983-0-9/09(A)