KTY81_SER_5

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 05 — 25 April 2008

12 of 15

NXP Semiconductors

KTY81 series

Silicon temperature sensors

8.

Packing information

Note: Types in bulk packaging have a lead-to-lead distance of 2.54 mm (see Figure 4).

The lead-to-lead distance of types packaged on reel have a lead-to-lead distance of

5.08 mm, spread leads (see Figure 5).

Fig 5.

Configuration of bandolier: spread leads

mbh795

(p)

P

A

L

F

W

t

∆ h

∆ h

T