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KTY81 Datasheet(PDF) 13 Page - NXP Semiconductors

Part # KTY81
Description  KTY81 series Silicon temperature sensors
PDF  15 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

KTY81 Datasheet(HTML) 13 Page - NXP Semiconductors

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KTY81_SER_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 25 April 2008
13 of 15
NXP Semiconductors
KTY81 series
Silicon temperature sensors
9.
Revision history
Table 13.
Tape specification
Symbol
Dimension
Specifications
Remarks
Min
Typ
Max
Tolerance
Unit
A1
body width
4.4
-
4.8
-
mm
A
body height
5
-
5.2
-
mm
T
body thickness
3.6
-
4.2
-
mm
P
pitch of component
-
12.7
-
±1mm
P0
feed hole pitch
-
12.7
-
±0.3
mm
cumulative pitch error
−1
-
+1
-
mm
measured over 20 devices
P2
feed hole center to component
center
-
6.35
-
±0.4
mm
to be measured at bottom of
clinch
F
lead-to-lead distance
-
5.08
-
+0.6/
−0.2
mm
spread leads
∆h
component alignment
-
0
1
-
mm
at top of body
W
tape width
-
18
-
±0.5
mm
W0
hold-down tape width
-
6
-
±0.2
mm
W1
hole position
-
9
-
+0.7/
−0.5
mm
W2
hold-down tape position
-
0.5
-
±0.2
mm
H0
lead wire clinch height
-
16.5
-
±0.5
mm
H1
component height
-
-
23.25
-
mm
L
length of snipped leads
-
-
11
-
mm
D0
feed hole diameter
-
4
-
±0.2
mm
t
total tape thickness
-
-
1.2
-
mm
t1 = 0.3 mm to 0.6 mm
F1, F2
lead to snipped lead distance
-
2.54
-
+0.4/
−0.2
mm
spread leads
H2
clinch height
-
2.5
-
+0.5/0
mm
(p)
pull-out force
6
-
-
-
N
Table 14.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
KTY81_SER_5
20080425
Product data sheet
-
KTY81-2SERIES_4
KTY81-1SERIES_3
Modifications:
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
KTY81-2SERIES_4
20000825
Product specification
-
-
KTY81-1SERIES_3
20000825
Product specification
-
-



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