REV. D

AD8072/AD8073

–4–

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD8072/AD8073 feature proprietary ESD protection circuitry, permanent damage

may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2 V

AD8072 8-Lead Plastic (N) . . . . . . . . . . . . . . . . . . 1.3 Watts

AD8072 8-Lead Small Outline (SO-8) . . . . . . . . . 0.9 Watts

AD8072 8-Lead

µSOIC (RM) . . . . . . . . . . . . . . . . 0.6 Watts

AD8073 14-Lead Plastic (N) . . . . . . . . . . . . . . . . . 1.6 Watts

AD8073 14-Lead Small Outline (R) . . . . . . . . . . . 1.0 Watts

Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .

±V

S

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . .

±1.25 V

Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . . . . . .

Storage Temperature Range

N, R, RM Packages . . . . . . . . . . . . . . . . . . –65

°C to +125°C

Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

8-Lead Plastic Package:

θ

°C/W

8-Lead SOIC Package:

θ

°C/W

8-Lead

µSOIC Package: θ

°C/W

14-Lead Plastic Package:

θ

°C/W

14-Lead SOIC Package:

θ

°C/W

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Description

Option

*AD8072ARM

–40

°C to +85°C 8-Lead µSOIC

RM-8

*AD8072ARM-REEL –40

°C to +85°C 13" Reel 8-Lead µSOIC RM-8

*AD8072ARM-REEL7 –40

°C to +85°C 7" Reel 8-Lead µSOIC RM-8

AD8072JN

0

°C to 70°C

8-Lead Plastic DIP

N-8

AD8072JR

0

°C to 70°C

8-Lead SOIC

SO-8

AD8072JR-REEL

0

°C to 70°C

13" Reel 8-Lead SOIC SO-8

AD8072JR-REEL7

0

°C to 70°C

7" Reel 8-Lead SOIC

SO-8

AD8073JN

0

°C to 70°C

14-Lead Plastic DIP

N-14

AD8073JR

0

°C to 70°C

14-Lead Narrow SOIC R-14

AD8073JR-REEL

0

°C to 70°C

13" Reel 14-Lead SOIC R-14

AD8073JR-REEL7

0

°C to 70°C

7" Reel 14-Lead SOIC R-14

*Brand Code: HLA

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the AD8072

and AD8073 is limited by the associated rise in junction tem-

perature. The maximum safe junction temperature for plastic

encapsulated devices is determined by the glass transition tem-

perature of the plastic, approximately 150

°C. Exceeding this

limit temporarily may cause a shift in parametric performance

due to a change in the stresses exerted on the die by the package.

Exceeding a junction temperature of 175

°C for an extended

period can result in device failure.

While the AD8072 and AD8073 are internally short circuit pro-

tected, this may not be sufficient to guarantee that the maximum

junction temperature (150

°C) is not exceeded under all condi-

tions. To ensure proper operation, it is necessary to observe the

maximum power derating curves shown in Figures 2 and 3.

AMBIENT TEMPERATURE – C

2.0

1.5

0

–50

90

–40 –30 –20 –10

0

10

20

30

5060

7080

40

1.0

0.5

8-LEAD MINI-DIP PACKAGE

8-LEAD SOIC PACKAGE

SOIC

Figure 2. AD8072 Maximum Power Dissipation vs.

Temperature

AMBIENT TEMPERATURE – C

2.5

2.0

0.5

–50

90

–40 –30 –20 –10 0

1020

3040 50

60

80

1.5

1.0

70

14-LEAD SOIC

14-LEAD DIP PACKAGE

Figure 3. AD8073 Maximum Power Dissipation vs.

Temperature

WARNING!

ESD SENSITIVE DEVICE