ADP121 datasheet(17/20 Pages) AD

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Data Sheet

ADP121

Rev. G | Page 17 of 20

140

120

100

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

VIN – VOUT (V)

MAX JUNCTION TEMPERATURE

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 25mA

ILOAD = 50mA

ILOAD = 75mA

ILOAD = 100mA

ILOAD = 150mA

Figure 46. TSOT, 100 mm2 of PCB Copper, Board Temperature = 85°C

140

120

100

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

VIN – VOUT (V)

MAX JUNCTION TEMPERATURE

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 25mA

ILOAD = 50mA

ILOAD = 75mA

ILOAD = 100mA

ILOAD = 150mA

Figure 47. WLCSP, 100 mm2 of PCB Copper, Board Temperature = 85°C

PCB LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of the ADP121. However,

as can be seen from Table 6 and Table 7, a point of diminishing

returns is eventually reached, beyond which an increase in the

copper size does not yield significant heat dissipation benefits.

Place the input capacitor as close as possible to the VIN and

GND pins. Place the output capacitor as close as possible to the

VOUT and GND pins. Use 0402 or 0603 size capacitors and

resistors to achieve the smallest possible footprint solution on

boards where area is limited.

VIN

VOUT

GND

ANALOG DEVICES

ADP121-xx-EVALZ

Figure 48. Example of TSOT PCB Layout

Figure 49. Example of WLCSP PCB Layout—Top Side

Figure 50. Example of WLCSP PCB Layout—Bottom Side

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