AM3703CUS datasheet(270/280 Pages) TI

270 / 280 page

AM3715, AM3703

SPRS616F

– JUNE 2010 – REVISED AUGUST 2011

www.ti.com

Package Characteristics

7.1

Package Thermal Characteristics

Table 7-1 and Table 7-2 provide the thermal resistance characteristics for the packages used on this

device.

Note: This table provides simulation data and may not represent actual use-case values.

Table 7-1. Thermal Resistance Characteristics 800MHz ARM Operation-4Gb DDR + Flash

PACKAGE

Power (W)(5)

θJA(°C/W)

(2)

θJB(°C/W)

(3)

θJC(°C/W)

(4)

BOARD TYPE

CBP Package

1.42

20.06

6.44

(6)

2S2P(1)

CBC Package

1.42

19.97

7.76

(6)

2S2P(1)

CUS Package

1.05

24.75

11.06

7.06

2S2P(1)

(1) The board types are defined by JEDEC (reference JEDEC standard JESD51-9, Test Board for Array Surface Mount Package Thermal

Measurements).

(2)

θJA (Theta-JA) = Thermal Resistance Junction-to-Ambient, °C/W

(3)

θJB (Theta-JB) = Thermal Resistance Junction-to-Board, °C/W

(4)

θJC (Theta-JC) = Thermal Resistance Junction-to-Board, °C/W

(5) These power numbers are based on simulation results for DM37x. Power numbers for CBP and CBC packages include the AM37x

device and POP memory. CUS package is AM37x only.

(6) Not applicable since these packages have memory package mounted on top.

Table 7-2. Thermal Resistance Characteristics 1GHz ARM Operation-8Gb DDR

PACKAGE

Power (W)(5)

θJA(°C/W)

(2)

θJB(°C/W)

(3)

θJC(°C/W)

(4)

BOARD TYPE

CBP Package

2.06

19.51

6.19

(6)

2S2P(1)

CBC Package

2.06

20.11

8.01

(6)

2S2P(1)

CUS Package

1.4

24.75

11.06

7.06

2S2P(1)

(1) The board types are defined by JEDEC (reference JEDEC standard JESD51-9, Test Board for Array Surface Mount Package Thermal

Measurements).

(2)

θJA (Theta-JA) = Thermal Resistance Junction-to-Ambient, °C/W

(3)

θJB (Theta-JB) = Thermal Resistance Junction-to-Board, °C/W

(4)

θJC (Theta-JC) = Thermal Resistance Junction-to-Board, °C/W

(5) These power numbers are based on simulation results for DM37x. Power numbers for CBP and CBC packages include the AM37x

device and POP memory. CUS package is AM37x only.

(6) Not applicable since these packages have memory package mounted on top.

7.2

Device Support

7.2.1

Device and Development-Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all

AM37x processors and support tools. Each device has one of three prefixes: X, P, or null (no prefix).

Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and

TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes

(TMDX) through fully qualified production devices/tools (TMDS).

Device development evolutionary flow:

Experimental device that is not necessarily representative of the final devices electrical

specifications and may not use production assembly flow. (TMX definition)

Prototype device that is not necessarily the final silicon die and may not necessarily meet

final electrical specifications. (TMP definition)

null

Production version of the silicon die that is fully qualified. (TMS definition)

270

Package Characteristics

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