LM2576 datasheet(6/37 Pages) TI1

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LM2576, LM2576HV

SNVS107C – JUNE 1999 – REVISED APRIL 2013

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ELECTRICAL CHARACTERISTICS ALL OUTPUT VOLTAGE VERSIONS

Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating Temperature

Range. Unless otherwise specified, VIN = 12V for the 3.3V, 5V, and Adjustable version, VIN = 25V for the 12V version, and VIN

= 30V for the 15V version. ILOAD = 500 mA.

LM2576-XX

Units

LM2576HV-XX

Symbol

Parameter

Conditions

(Limits)

Typ

Limit (1)

DEVICE PARAMETERS

Feedback Bias Current

VOUT = 5V (Adjustable Version Only)

100/500

Oscillator Frequency

See (2)

kHz

47/42

kHz (Min)

58/63

kHz (Max)

VSAT

Saturation Voltage

IOUT = 3A

(3)

1.4

1.8/2.0

V(Max)

Max Duty Cycle (ON)

See (4)

%(Min)

ICL

Current Limit

See (3)(2)

5.8

4.2/3.5

A(Min)

6.9/7.5

A(Max)

Output Leakage Current

Output = 0V

mA(Max)

Output =

−1V

7.5

Output =

−1V (5)(6)

mA(Max)

Quiescent Current

See (5)

mA(Max)

ISTBY

Standby Quiescent

ON /OFF Pin = 5V (OFF)

μA

Current

200

μA(Max)

θJA

Thermal Resistance

T Package, Junction to Ambient (7)

θJA

T Package, Junction to Ambient (8)

°C/W

θJC

T Package, Junction to Case

θJA

S Package, Junction to Ambient (9)

ON /OFF CONTROL Test Circuit Figure 21 and Figure 22

VIH

ON /OFF Pin

VOUT = 0V

1.4

2.2/2.4

V(Min)

Logic Input Level

VIL

VOUT = Nominal Output Voltage

1.2

1.0/0.8

V(Max)

IIH

ON /OFF Pin Input

ON /OFF Pin = 5V (OFF)

μA

Current

μA(Max)

IIL

ON /OFF Pin = 0V (ON)

μA

μA(Max)

(1)

All limits specified at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits

are 100% production tested. All limits at temperature extremes are specified via correlation using standard Statistical Quality Control

(SQC) methods.

(2)

The oscillator frequency reduces to approximately 11 kHz in the event of an output short or an overload which causes the regulated

output voltage to drop approximately 40% from the nominal output voltage. This self protection feature lowers the average power

dissipation of the IC by lowering the minimum duty cycle from 5% down to approximately 2%.

(3)

Output pin sourcing current. No diode, inductor or capacitor connected to output.

(4)

Feedback pin removed from output and connected to 0V.

(5)

Feedback pin removed from output and connected to +12V for the Adjustable, 3.3V, and 5V versions, and +25V for the 12V and 15V

versions, to force the output transistor OFF.

(6)

VIN = 40V (60V for high voltage version).

(7)

Junction to ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with ½ inch leads in a

socket, or on a PC board with minimum copper area.

(8)

Junction to ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with ¼ inch leads

soldered to a PC board containing approximately 4 square inches of copper area surrounding the leads.

(9)

If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area thermally

connected to the package. Using 0.5 square inches of copper area,

θJA is 50°C/W, with 1 square inch of copper area, θJA is 37°C/W,

and with 1.6 or more square inches of copper area,

θJA is 32°C/W.

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