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48GA004 Datasheet(PDF) 231 Page - Microchip Technology |
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48GA004 Datasheet(HTML) 231 Page - Microchip Technology |
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231 / 268 page ![]() 2010 Microchip Technology Inc. DS39881D-page 231 PIC24FJ64GA004 FAMILY TABLE 27-1: THERMAL OPERATING CONDITIONS Rating Symbol Min Typ Max Unit PIC24FJ64GA004 Family: Operating Junction Temperature Range TJ -40 — +140 °C Operating Ambient Temperature Range TA -40 — +125 °C Power Dissipation: Internal Chip Power Dissipation: PINT = VDD x (IDD – IOH) PD PINT + PI/O W I/O Pin Power Dissipation: PI/O = ({VDD – VOH} x IOH) + (VOL x IOL) Maximum Allowed Power Dissipation PDMAX (TJ – TA)/ JA W TABLE 27-2: THERMAL PACKAGING CHARACTERISTICS Characteristic Symbol Typ Max Unit Notes Package Thermal Resistance, 300 mil SOIC JA 49 — °C/W (Note 1) Package Thermal Resistance, 6x6x0.9 mm QFN JA 33.7 — °C/W (Note 1) Package Thermal Resistance, 8x8x1 mm QFN JA 28 — °C/W (Note 1) Package Thermal Resistance, 10x10x1 mm TQFP JA 39.3 — °C/W (Note 1) Note 1: Junction to ambient thermal resistance, Theta-JA ( JA) numbers are achieved by package simulations. |
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