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TSB41AB1 Datasheet(PDF) 19 Page - Texas Instruments |
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TSB41AB1 Datasheet(HTML) 19 Page - Texas Instruments |
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19 / 70 page  TSB41AB1 IEEE 1394a2000 ONEPORT CABLE TRANSCEIVER/ARBITER SLLS423I − JUNE 2000 − REVISED MARCH 2005 19 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 thermal characteristics, PAP package PARAMETER TEST CONDITIONS† MIN TYP MAX UNIT RθJA Junction-to-ambient thermal resistance Board-mounted, no air flow, high conductivity TI-recommended test board, chip soldered or 26 °C/W RθJC Junction-to-case-thermal resistance TI-recommended test board, chip soldered or greased to thermal land with 1 oz. copper 5.9 °C/W RθJA Junction-to-ambient thermal resistance Board-mounted, no air flow, high conductivity TI-recommended test board with thermal land, but 58.6 °C/W RθJC Junction-to-case thermal resistance TI-recommended test board with thermal land, but no solder or grease thermal connection to thermal land with 1 oz. copper 5.9 °C/W RθJA Junction-to-ambient thermal resistance Board-mounted, no air flow, low conductivity 60.1 °C/W RθJC Junction-to-case thermal resistance Board-mounted, no air flow, low conductivity JEDEC test board with 1 oz. copper 5.9 °C/W † Use of thermally enhanced PowerPad PAP package is assumed in all three test conditions. thermal characteristics, PHP package PARAMETER TEST CONDITIONS† MIN TYP MAX UNIT RθJA Junction-to-ambient thermal resistance Board-mounted, no air flow, high conductivity TI-recommended test board, chip soldered or 31.9 °C/W RθJC Junction-to-case-thermal resistance TI-recommended test board, chip soldered or greased to thermal land with 1 oz. copper 6.2 °C/W RθJA Junction-to-ambient thermal resistance Board-mounted, no air flow, high conductivity TI-recommended test board with thermal land, but 65.8 °C/W RθJC Junction-to-case thermal resistance TI-recommended test board with thermal land, but no solder or grease thermal connection to thermal land with 1 oz. copper 6.2 °C/W RθJA Junction-to-ambient thermal resistance Board-mounted, no air flow, low conductivity 85.7 °C/W RθJC Junction-to-case thermal resistance Board-mounted, no air flow, low conductivity JEDEC test board with 1 oz. copper 6.2 °C/W † Use of thermally enhanced PowerPad PHP package is assumed in all three test conditions. thermal characteristics, GQE package PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RθJA Junction-to-ambient thermal resistance Board-mounted, no air flow, JEDEC low-k test 118.12 °C/W RθJC Junction-to-case-thermal resistance Board-mounted, no air flow, JEDEC low-k test board, no thermal vias used on board 38.62 °C/W RθJA Junction-to-ambient thermal resistance Board-mounted, no air flow, JEDEC high-k test 56.61 °C/W RθJC Junction-to-case-thermal resistance Board-mounted, no air flow, JEDEC high-k test board, no thermal vias used on board 38.62 °C/W thermal characteristics, ZQE package PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RθJA Junction-to-ambient thermal resistance Board-mounted, no air flow, JEDEC low-k test 119.63 °C/W RθJC Junction-to-case-thermal resistance Board-mounted, no air flow, JEDEC low-k test board, no thermal vias used on board 39.03 °C/W RθJA Junction-to-ambient thermal resistance Board-mounted, no air flow, JEDEC high-k test 58.32 °C/W RθJC Junction-to-case-thermal resistance Board-mounted, no air flow, JEDEC high-k test board, no thermal vias used on board 39.09 °C/W |
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