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LM4819MM Datasheet(PDF) 18 Page - Texas Instruments

Part # LM4819MM
Description  LM4819 350mW Audio Power Amplifier with Shutdown Mode
PDF  27 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

LM4819MM Datasheet(HTML) 18 Page - Texas Instruments

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LM4819, LM4819MBD
SNAS133D – FEBRUARY 2001 – REVISED MARCH 2013
www.ti.com
Table 1. Mono LM4819 Reference Design Boards
Bill of Material for all Demo Boards (continued)
Item
Part Number
Part Description
Qty
Ref Designator
21
151911207-002
Cer Cap 0.39uF 50V Z5U 20% 1210
1
C2
25
152911207-001
Tant Cap 1uF 16V 10
1
C3
30
472911207-001
Res 20K Ohm 1/10W 5
3
R1, R2, R3
35
210007039-002
Jumper Header Vertical Mount 2X1 0.100
2
J1, J2
PCB LAYOUT GUIDELINES
This section provides practical guidelines for mixed signal PCB layout that involves various digital/analog power
and ground traces. Designers should note that these are only "rule-of-thumb" recommendations and the actual
results will depend heavily on the final layout.
General Mixed Signal Layout Recommendation
Power and Ground Circuits
For two layer mixed signal design, it is important to isolate the digital power and ground trace paths from the
analog power and ground trace paths. Star trace routing techniques (bringing individual traces back to a central
point rather than daisy chaining traces together in a serial manner) can have a major impact on low level signal
performance. Star trace routing refers to using individual traces to feed power and ground to each circuit or even
device. This technique will take require a greater amount of design time but will not increase the final price of the
board. The only extra parts required will be some jumpers.
Single-Point Power / Ground Connections
The analog power traces should be connected to the digital traces through a single point (link). A "Pi-filter" can
be helpful in minimizing high frequency noise coupling between the analog and digital sections. It is further
recommended to put digital and analog power traces over the corresponding digital and analog ground traces to
minimize noise coupling.
Placement of Digital and Analog Components
All digital components and high-speed digital signals traces should be located as far away as possible from
analog components and circuit traces.
Avoiding Typical Design / Layout Problems
Avoid ground loops or running digital and analog traces parallel to each other (side-by-side) on the same PCB
layer. When traces must cross over each other do it at 90 degrees. Running digital and analog traces at 90
degrees to each other from the top to the bottom side as much as possible will minimize capacitive noise
coupling and cross talk.
18
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Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: LM4819 LM4819MBD



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