LM4819MM datasheet(3/27 Pages) TI

3 / 27 page

LM4819, LM4819MBD

www.ti.com

SNAS133D – FEBRUARY 2001 – REVISED MARCH 2013

Absolute Maximum Ratings

(1) (2) (3)

Supply Voltage

6.0V

Storage Temperature

−65°C to +150°C

Input Voltage

−0.3V to VDD +0.3V

Power Dissipation (PD)

(4)

Internally Limited

ESD Susceptibility(5)

3.5kV

ESD Susceptibility(6)

250V

Junction Temperature (TJ)

150°C

Soldering Information

Small Outline Package

Vapor Phase (60 seconds)

215°C

Infrared (15 seconds)

220°C

Thermal Resistance

θJC (VSSOP)

56°C/W

θJA (VSSOP)

210°C/W

θJC (SOIC)

35°C/W

θJA (SOIC)

170°C/W

θJA (WSON)

117°C/W(7)

θJA (WSON)

150°C/W(8)

(1)

All voltages are measured with respect to the ground pin, unless otherwise specified.

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical

specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the

Operating Ratings. Specifications are not ensured for parameters where no limit is given. However, the typical value is a good indication

of device's performance.

(3)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(4)

The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature

TA. The maximum allowable power dissipation is PDMAX = (TJMAX–TA)/θJA. For the LM4819, TJMAX = 150°C and the typical junction-to-

ambient thermal resistance (

θJA) when board mounted is 210°C/W for the VSSOP package and 170°C/W for the SOIC package.

(5)

Human body model, 100pF discharged through a 1.5 k

Ω resistor.

(6)

Machine Model, 220pF–240pF capacitor is discharged through all pins.

(7)

The given

θJA is for an LM4819 package in an NGL0008B with the Exposed-DAP soldered to a printed circuit board copper pad with an

area equivalent to that of the Exposed-DAP itself. The Exposed-DAP of the NGL0008B package should be electrically connected to

GND or an electrically isolated copper area.

(8)

The given

θJA is for an LM4819 package in an NGL0008B with the Exposed-DAP not soldered to any printed circuit board copper.

Operating Ratings

(1) (2)

Temperature Range

−40°C ≤ TA ≤ 85°C

TMIN ≤ TA ≤ TMAX

Supply Voltage

2.0V

≤ VCC ≤ 5.5V

(1)

All voltages are measured with respect to the ground pin, unless otherwise specified.

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical

specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the

Operating Ratings. Specifications are not ensured for parameters where no limit is given. However, the typical value is a good indication

of device's performance.

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