7

LTC1384

1384fa

PACKAGE DESCRIPTIO

G20 SSOP 0802

0.09 – 0.25

(.0035 – .010)

0° – 8°

0.55 – 0.95

(.022 – .037)

5.00 – 5.60**

(.197 – .221)

7.40 – 8.20

(.291 – .323)

12 3

4

5

6 7 89 10

6.90 – 7.50*

(.272 – .295 )

17

18

14 13 12 11

15

16

19

20

2.0

(.079)

0.05

(.002)

0.65

(.0256)

BSC

0.22 – 0.38

(.009 – .015)

MILLIMETERS

(INCHES)

DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED .152mm (.006") PER SIDE

DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE

*

**

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

0.42 ±0.03

0.65 BSC

5.3 – 5.7

7.8 – 8.2

RECOMMENDED SOLDER PAD LAYOUT

1.25 ±0.12

N18 1002

.020

(0.508)

MIN

.120

(3.048)

MIN

.130 ± .005

(3.302 ± 0.127)

.065

(1.651)

TYP

.045 – .065

(1.143 – 1.651)

.018 ± .003

(0.457 ± 0.076)

.005

(0.127)

MIN

.255 ± .015*

(6.477 ± 0.381)

.900*

(22.860)

MAX

18

12

3

4

56

7

8

9

10

11

12

13

14

16

15

17

.008 – .015

(0.203 – 0.381)

.300 – .325

(7.620 – 8.255)

.325

+.035

–.015

+0.889

–0.381

8.255

()

NOTE:

1. DIMENSIONS ARE

INCHES

MILLIMETERS

*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)

.100

(2.54)

BSC

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

N Package

18-Lead PDIP (Narrow .300 Inch)

(Reference LTC DWG # 05-08-1510)

G Package

20-Lead Plastic SSOP (5.3mm)

(Reference LTC DWG # 05-08-1640)