5

LTC1384

1384fa

with a 0.1µF ceramic capacitor.

GND: Ground Pin.

ON/OFF: TTL/CMOS Compatible Shutdown Pin. A logic

low puts the device in the Shutdown mode independent of

the RX EN pin. The supply current of the device drops to

35µA (two receivers alive) and both driver outputs are

forced into three-state.

RX EN: TTL/CMOS Compatible Receiver Enable Pin. A

logic high forces the receiver outputs into three-state. A

logic low enables the receiver outputs.

2V. This pin requires an external capacitor C = 0.1µF for

charge storage. The capacitor may be tied to ground or

a common capacitor. For large numbers of devices, in-

creasing the size of the shared common storage capaci-

tors is recommended to reduce ripple.

– 2V). This pin requires an external capacitor C = 0.1µF for

charge storage.

Figure 1. Driver Propagation Delay Timing

Figure 2. Receiver Propagation Delay Timing

1.4V

0V

0V

0V

DRIVER

INPUT

DRIVER

OUTPUT

1.4V

LTC1384 • F01

0.8V

0V

2.4V

RX

INPUT

RX

OUTPUT

1.3V

1.7V

LTC1384 • F02

0V

SWITCHI G TI E WAVEFOR S

pins require two external capacitors C = 0.1µF: one from

charge pump efficiency, the capacitor’s effective series

resistance should be less than 2Ω.

TR IN: RS232 Driver Input Pins. Inputs are TTL/CMOS

compatible. The inputs of unused drivers can be left

included on chip. To minimize power consumption, the

in the Shutdown mode.

TR OUT: Driver Outputs at RS232 Voltage Levels. Outputs

= 0V. The driver outputs are protected against ESD to

±10kV for human body model discharges.

RX IN: Receiver Inputs. These pins can be forced to ±25V

without damage. The receiver inputs are protected against

ESD to ±10kV for human body model discharges. Each

receiver provides 0.4V of hysteresis for noise immunity.

RX OUT: Receiver Outputs with TTL/CMOS Voltage Lev-

els. A logic high at RX EN puts the outputs into three-state.

PI FU CTIO S