ADF4153 datasheet(23/24 Pages) AD

23 / 24 page

Data Sheet

ADF4153

Rev. F | Page 23 of 24

OUTLINE DIMENSIONS

PIN 1

SEATING

PLANE

8°

0°

4.50

4.40

4.30

6.40

BSC

5.10

5.00

4.90

0.65

BSC

0.15

0.05

1.20

MAX

0.20

0.09

0.75

0.60

0.45

0.30

0.19

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 21. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

3.75

BCS SQ

COMPLIANT

TO JEDEC STANDARDS MO-220-VGGD-1

0.50

BSC

PIN 1

INDICATOR

0.75

0.60

0.50

TOP VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

COPLANARITY

0.08

1.00

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

2.25

2.10 SQ

1.95

0.60 MAX

0.25 MIN

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

BOTTOM VIEW

EXPOSED

PAD

4.10

4.00 SQ

3.90

Figure 22. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad

(CP-20-1)

Dimensions shown in millimeters

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