Copyright

© ANPEC Electronics Corp.

Rev. A.6 - Aug., 2009

APW7065

www.anpec.com.tw

2

Symbol

Parameter

Rating

Unit

VCC

VCC to GND

-0.3 ~ 16

V

BOOT

BOOT to PHASE

-0.3 ~ 16

V

UGATE

UGATE to PHASE

<400ns Pulse Width

>400ns Pulse Width

-5 ~ BOOT+5

-0.3 ~ BOOT+0.3

V

LGATE

LGATE to GND

<400ns Pulse Width

>400ns Pulse Width

V

PHASE

PHASE to GND

<200ns Pulse Width

>200ns Pulse Width

-10 ~ 30

-0.3 ~ 16

V

COMP, FB

COMP, FB to GND

-0.3 ~ 7

V

Junction Temperature Range

-20 ~ 150

Storage Temperature

-65 ~ 150

Maximum Lead Soldering Temperature, 10 Seconds

260

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Thermal Resistance in Free Air

(Note 2)

SOP-8

75

θ

JC

Junction-to-Case Thermal Resistance

SOP-8

28

Ordering and Marking Information

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

APW7065

Handling Code

Temperature Range

Package Code

APW7065 K :

APW7065

XXXXX

XXXXX - Date Code

Assembly Material

Package Code

K : SOP-8

Operating Ambient Temperature Range

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

Note 2:

θ