AIC1521 datasheet(7/9 Pages) AIC

7 / 9 page

AIC1521

n PIN DESCRIPTION

MSOP8, SO8

PIN 1/4/6/8: NC:

PIN 2: CTL

- TTL compatible control input. It

controls the power switch turn-

on/turn-off.

Active

High

for

AIC1521-1 and active low for

AIC1521-0.

PIN 3: IN-

Power supply input.

PIN 4: GND-

Chip power ground.

PN 7: OUT- MOSFET switch output.

SOT89-5

PIN 1:

- Power supply input.

PIN 2:

GND

- Chip power ground.

PIN 3:

OUT

- MOSFET switch output.

PIN 4:

PIN 5:

CTL

- TTL compatible control input. It

controls the power switch turn-

on/turn-off.

Active

High

for

AIC1521-1 and active low for

AIC1521-0.

n APPLICATION INFORMATIONS

l Current Limit

The current limit threshold is preset internally. It

protects the output MOSFET switches from

damage

due

undesirable

short

circuit

conditions

excess

inrush

current

often

encountered during hot plug-in. The

AIC1521

allows minimum 500mA continuous load current

per Channel.

l Thermal Protection

When the chip temperature exceeds 110

°C, the

thermal protection function works.

l Supply Filtering

A 0.1uF to 1uF bypass capacitor from IN to GND,

located near the device, is strongly recommended

to control supply transients. Without a bypass

capacitor, an output short may cause sufficient

ringing on the input (from supply lead inductance) to

damage internal control circuitry.

l Transient Droop Requirements

USB support dynamic attachment (hot plug-in) of

peripherals. A current surge is caused by the input

capacitance of downstream device. Ferrite beads

are recommended in series with all power and

ground connector pins. Ferrite beads reduce EMI

and limit the inrush current during hot-attachment

by filtering high-frequency signals.

l Short Circuit Transient

Bulk capacitance provides the short-term transient

current needed during a hot-attachment event. With

a 33uF, 16V tantalum or 100uF, 10V electrolytic

capacitor mounted close to downstream connector

should provide transient drop protection.

l Printed Circuit Layout

The power circuitry of USB printed circuit boards

requires a customized layout to maximize thermal

dissipation and to minimize voltage drop and EMI.

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